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fn7111 rev 4.00 page 1 of 17 may 4, 2007 fn7111 rev 4.00 may 4, 2007 el5127, el5227, e l5327, el5427 2.5mhz 4-, 8-, 10- and 12-channel rail-to-rail buffers datasheet the el5127, el5227, el5327, and el5427 are low power, high voltage rail-to-rail input/ou tput buffers designed for use in reference voltage buffering applications in small lcd displays. they are available in quad (el5127), octal (el5227), 10-channel (el5327) , and 12-channel (el5427) topologies. all buffers feature a -3db bandwidth of 2.5mhz and operate from just 133a per buffer. this family also features a continuous output drive capability of 30ma (sink and source). the quad channel el5127 is ava ilable in the 10 ld msop package. the 8-channel el5227 is available in both the 20 ld tssop and 24 ld qfn packages, the 10-channel el5327 in the 24 ld tssop and 24 ld qfn packages, and the 12-channel el5427 in the 28 ld tssop and 32 ld qfn packages. all buffers are specified for operation over the full -40c to +85c temperature range. features ? 2.5mhz -3db bandwidth ? supply voltage = 4.5v to 16.5v ? low supply current (per buffer) = 133a ? high slew rat e = 2.2v/s ? rail-to-rail input/output swing ? ultra-small packages ? pb-free plus anneal available (rohs compliant) applications ? tft-lcd drive circuits ? electronic games ? touch-screen displays ? personal communication devices ? personal digital assistants (pdas) ? portable instrumentation n o t r e c o m m e n d e d f o r n e w d e s i g n s n o r e c o m m e n d e d r e p l a c e m e n t c o n t a c t o u r t e c h n i c a l s u p p o r t c e n t e r a t 1 - 8 8 8 - i n t e r s i l o r w w w . i n t e r s i l . c o m / t s c
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 2 of 17 may 4, 2007 ordering information part number part marking tape & reel package pkg. dwg. # el5127cy r - 10 ld msop (3.0mm) mdp0043 el5127cy-t7 r 7 10 ld msop (3.0mm) mdp0043 el5127cy-t13 r 13 10 ld msop (3.0mm) mdp0043 el5127cyz (note) baaah - 10 ld msop (3.0mm) (pb-free) mdp0043 el5127cyz-t7 (note) baaah 7 10 ld msop (3.0mm) (pb-free) mdp0043 el5127cyz-t13 (note) baaah 13 10 ld msop (3.0mm) (pb-free) mdp0043 el5227cl 5227cl - 24 ld qfn (4mmx5mm) mdp0046 el5227cl-t7 5227cl 7 24 ld qfn (4mmx5mm) mdp0046 el5227cl-t13 5227cl 13 24 ld qfn (4mmx5mm) mdp0046 el5227clz (note) 5227clz - 24 ld qfn (4mmx5mm) (pb-free) mdp0046 el5227clz-t7 (note) 5227clz 7 24 ld qfn (4mmx5mm) (pb-free) mdp004 6 el5227clz-t13 (note) 5227clz 13 24 ld qfn (4mmx5mm) (pb-free) mdp0 046 el5227cr 5227cr - 20 ld tssop (4.4mm) mdp0044 el5227cr-t7 5227cr 7 20 ld tssop (4.4mm) mdp0044 EL5227CR-T13 5227cr 13 20 ld tssop (4.4mm) mdp0044 el5227crz (note) 5227crz - 20 ld tssop (4.4mm) (pb-free) m20.173 el5227crz-t7 (note) 5227crz 7 20 ld tssop (4.4mm) (pb-free) m20.17 3 el5227crz-t13 (note) 5227crz 13 20 ld tssop (4.4mm) (pb-free) m20. 173 el5327cl 5327cl - 24 ld qfn (4mmx5mm) mdp0046 el5327cl-t7 5327cl 7 24 ld qfn (4mmx5mm) mdp0046 el5327cl-t13 5327cl 13 24 ld qfn (4mmx5mm) mdp0046 el5327clz (note) 5327clz - 24 ld qfn (4mmx5mm) (pb-free) mdp0046 el5327clz-t7 (note) 5327clz 7 24 ld qfn (4mmx5mm) (pb-free) mdp004 6 el5327clz-t13 (note) 5327clz 13 24 ld qfn (4mmx5mm) (pb-free) mdp0 046 el5327cr 5327cr - 24 ld tssop (4.4mm) mdp0044 el5327cr-t7 5327cr 7 24 ld tssop (4.4mm) mdp0044 el5327cr-t13 5327cr 13 24 ld tssop (4.4mm) mdp0044 el5327crz (note) 5327crz - 24 ld tssop (4.4mm) (pb-free) mdp0044 el5327crz-t7 (note) 5327crz 7 24 ld tssop (4.4mm) (pb-free) mdp004 4 el5327crz-t13 (note) 5327crz 13 24 ld tssop (4.4mm) (pb-free) mdp0 044 el5427cl 5427cl - 32 ld qfn (5mmx6mm) mdp0046 el5427cl-t7 5427cl 7 32 ld qfn (5mmx6mm) mdp0046 el5427cl-t13 5427cl 13 32 ld qfn (5mmx6mm) mdp0046 el5427clz (note) 5427clz - 32 ld qfn (5mmx6mm) (pb-free) mdp0046 el5427clz-t7 (note) 5427clz 7 32 ld qfn (5mmx6mm) (pb-free) mdp004 6
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 3 of 17 may 4, 2007 el5427clz-t13 (note) 5427clz 13 32 ld qfn (5mmx6mm) (pb-free) mdp0 046 el5427cr 5427cr - 28 ld tssop (4.4mm) mdp0044 el5427cr-t13 5427cr 13 28 ld tssop (4.4mm) mdp0044 el5427crz (note) 5427crz - 28 ld tssop (4.4mm) (pb-free) mdp0044 el5427crz-t7 (note) 5427crz 7 28 ld tssop (4.4mm) (pb-free) mdp004 4 el5427crz-t13 (note) 5427crz 13 28 ld tssop (4.4mm) (pb-free) mdp0 044 note: intersil pb-free plus anneal products employ special pb-fr ee material sets; molding compounds/die attach materials and 10 0% matte tin plate termination finish, which are rohs compliant and compatible wit h both snpb and pb-free solderi ng operations. intersil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exc eed the pb-free requirements of ipc/jedec j std-020. ordering information (continued) part number part marking tape & reel package pkg. dwg. #
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 4 of 17 may 4, 2007 pinouts el5127 (10 ld msop) top view el5227 (20 ld tssop) top view el5327 (24 ld tssop) top view el5427 (28 ld tssop) top view el5227, el5327 (24 ld qfn) top view el5427 (32 ld qfn) top view 1 2 3 4 10 9 8 7 5 6 vin1 vin2 vs+ vin3 vin4 vout1 vout2 vout3 vout4 vs- 1 2 3 4 16 15 14 13 5 6 7 12 11 9 8 10 20 19 18 17 vin1 vin2 vin3 vin4 vs+ vout1 vout2 vout4 vs- vout3 vs+ vin5 vin6 vin7 vin8 vs- vout5 vout7 vout8 vout6 1 2 3 4 16 15 14 13 5 6 7 12 11 9 8 10 20 19 18 17 24 23 22 21 vin1 vin2 vin3 vin4 vin5 vout1 vout2 vout4 vout5 vout3 vs+ vs+ vin6 vin7 vin8 vs- vs- vout7 vout8 vout6 vin9 vin10 vout9 vout10 1 2 3 4 28 27 26 25 5 6 7 24 23 22 8 21 9 10 20 19 11 12 13 18 17 16 14 15 vin1 vin2 vin3 vin4 vin5 vout1 vout2 vout4 vout5 vout3 vin6 vs+ vs+ vin7 vin8 vout6 vs- vout7 vout8 vs- vin9 vin10 vin11 vin12 vout9 vout11 vout12 vout10 vin3 vin4 vin5 vs+ vin6 vin7 vin8 vout3 vout4 vout5 vs- vout6 vout7 vout8 vin2 vin1* nc vout1* vout2 vin9 cvin10* nc vout10* vout9 19 18 17 16 15 14 13 24 23 22 21 20 8 9 10 11 12 1 2 3 4 5 6 7 thermal pad * not available in el5227 thermal pad 25 24 23 22 21 20 19 32 31 30 29 28 10 11 12 13 14 1 2 3 4 5 6 7 vin3 vin4 vin5 vin6 vs+ vin7 vin8 vout3 vout4 vout5 vout6 vs- vout7 vout8 vin2 vin1 nc nc nc vin11 vin12 nc nc nc 8 9 18 17 15 27 16 26 vout9 vout10 vout12 vout11 vin9 vin10 vout1 vout2
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 5 of 17 may 4, 2007 important note: all parameters having min/max specifications are guaranteed. typ values are for information purposes only. unles s otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: t j = t c = t a absolute maximum ratings (t a = +25c) thermal information supply voltage between v s + and v s -. . . . . . . . . . . . . . . . . . . .+18v input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . v s - -0.5v, v s +0.5v maximum continuous output current . . . . . . . . . . . . . . . . . . . 30ma esd voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kv maximum die temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125c storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65c to +150c power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see curves operating temperature . . . . . . . . . . . . . . . . . . . . . . .-40c to +85c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. electrical specifications v s + = +5v, v s - = -5v, r l = 10k ? , c l = 10pf to 0v, t a = +25c, unless otherwise specified. parameter description conditions min typ max unit input characteristics v os input offset voltage v cm = 0v 1 15 mv tcv os average offset voltage drift (note 1) 5 v/c i b input bias current v cm = 0v 2 50 na r in input impedance 1g ? c in input capacitance 1.35 pf a v voltage gain -4.5v ? v out ? 4.5v 0.99 1.01 v/v output characteristics v ol output swing low i l = -5ma -4.95 -4.85 v v oh output swing high i l = +5ma 4.85 4.95 v i out (max) max output current (note 2) r l = 10 ? 100 120 ma power supply performance psrr power supply rejection ratio v s is moved from 2.25v to 7.75v 55 80 db i s supply current no load (el5127) 0.7 0.9 ma no load (el5227) 1.2 1.4 ma no load (el5327) 1.4 2 ma no load (el5427) 1.6 2.2 ma dynamic performance sr slew rate (note 3) -4.0v ?? v out ?? 4.0v, 20% to 80% 0.9 2.2 v/s t s settling to +0.1% (a v = +1) (a v = +1), v o = 2v step 900 ns bw -3db bandwidth r l = 10k ? , c l = 10pf 2.5 mhz cs channel separation f = 100khz 75 db notes: 1. measured over operating temperature range. 2. instantaneous peak current. 3. slew rate is measured on rising and falling edges.
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 6 of 17 may 4, 2007 electrical specifications v s + = +5v, v s - = 0v, r l = 10k ? , c l = 10pf to 2.5v, t a = +25c, unless otherwise specified. parameter description condition min typ max unit input characteristics v os input offset voltage v cm = 2.5v 1 15 mv tcv os average offset voltage drift (note 4) 5 v/c i b input bias current v cm = 2.5v 2 50 na r in input impedance 1g ? c in input capacitance 1.35 pf a v voltage gain 0.5v ? v out ? 4.5v 0.99 1.01 v/v output characteristics v ol output swing low i l = -5ma 80 150 mv v oh output swing high i l = +5ma 4.85 4.95 v i out (max) output current (note 5) r l = 10 ? 100 120 ma power supply performance psrr power supply rejection ratio v s is moved from 4.5v to 15.5v 55 80 db i s supply current no load (el5127) 0.7 0.9 ma no load (el5227) 1.1 1.35 ma no load (el5327) 1.35 1.9 ma no load (el5427) 1.5 2.05 ma dynamic performance sr slew rate (note 6) 1v ?? v out ?? 4v, 20% to 80% 0.9 1.5 v/s t s settling to +0.1% (a v = +1) (a v = +1), v o = 2v step 1000 ns bw -3db bandwidth r l = 10k ? , c l = 10pf 2.5 mhz cs channel separation f = 5mhz 75 db notes: 4. measured over operating temperature range. 5. instantaneous peak current. 6. slew rate is measured on rising and falling edges.
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 7 of 17 may 4, 2007 electrical specifications v s + = +15v, v s - = 0v, r l = 10k ? , c l = 10pf to 7.5v, t a = +25c, unless otherwise specified. parameter description condition min typ max unit input characteristics v os input offset voltage v cm = 7.5v 1 18 mv tcv os average offset voltage drift (note 7) 5 v/c i b input bias current v cm = 7.5v 2 50 na r in input impedance 1g ? c in input capacitance 1.35 pf av voltage gain 0.5v ? v out ? 14.5v 0.99 1.01 v/v output characteristics v ol output swing low i l = -5ma 50 150 mv v oh output swing high i l = +5ma 14.85 14.95 v i out (max) output current (note 8) r l = 10 ? 100 120 ma power supply performance psrr power supply rejection ratio v s is moved from 4.5v to 15.5v 55 80 db i s supply current no load (el5127) 0.75 0.95 ma no load (el5227) 1.3 1.55 ma no load (el5327) 1.5 2.1 ma no load (el5427) 1.6 2.4 ma dynamic performance sr slew rate (note 9) 1v ?? v out ?? 14v, 20% to 80% 0.9 2.2 v/s t s settling to +0.1% (a v = +1) (a v = +1), v o = 2v step 900 ns bw -3db bandwidth r l = 10k ? , c l = 10pf 2.5 mhz cs channel separation f = 5mhz 75 db notes: 7. measured over operating temperature range. 8. instantaneous peak current. 9. slew rate is measured on rising and falling edges.
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 8 of 17 may 4, 2007 typical performance curves figure 1. freqeuncy response for various r l figure 2. frequency response for various c l figure 3. output impedance vs frequency figure 4. maximum output s wing vs frequency figure 5. input voltage noise spectral density vs frequency figure 6. total harmonic distortion + noise vs frequency 20 10 0 -10 -20 -30 1k 10k 100k 1m 10m frequency (hz) normalized magnitude (db) 1k ? 10k ? 562 ? 150 ? c l =10pf v s =5v 20 10 0 -10 -20 -30 1k 10k 100k 1m 10m frequency (hz) normalized magnitude (db) 47pf 12pf 1nf 100pf r l =10k ? v s =5v 2000 1600 1200 800 400 0 1k 10k 100k 1m frequency (hz) output impedance ( ? ) t a =25c v s =5v 12 10 8 6 4 0 10k 100k 1m 10m frequency (hz) maximum output swing (v p-p ) 2 v s =5v r l =10k ? c l =12pf t a =25c 300 100 10 1k 10k 100k 10m 100m frequency (hz) voltage noise (nv/ ? hz) 1m 0.12 0.1 0.08 0.06 0.04 0.02 0 1k 10k 100k frequency (hz) thd + noise (%)
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 9 of 17 may 4, 2007 figure 7. small signal overshoot vs load capacitance figure 8. input offset voltage distribution figure 9. input bias current vs te mperature figure 10. output high voltage vs temperature figure 11. output low voltage vs temperature figure 12. voltage ga in vs temperature typical performance curves 100 30 20 0 10 100 1k capacitance (pf) overshoot (%) 90 70 50 80 60 40 v s =5v r l =10k ? v in =50mv t a =25c 18 16 14 12 10 8 6 4 2 0 -10 -8 -6 -4 -2 0 2 4 6 8 10 input offset voltage (mv) % of buffers 3.5 3 2.5 2 1.5 1 85 temperature (c) input bias current (na) -35 -15 5 25 45 65 v s =5v 4.955 4.95 4.945 4.94 4.935 4.925 85 temperature (c) output high voltage (v) -35-15 5 254565 4.93 v s =5v i out =5ma -4.938 -4.958 85 temperature (c) output low voltage (v) -35-15 5 254565 -4.942 -4.946 -4.95 -4.954 v s =5v i out =-5ma 1.0045 1.004 1.003 1.0025 1.002 1.001 85 temperature (c) voltage gain (v/v) -35 -15 5 25 45 65 1.0015 1.0035 v s =5v
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 10 of 17 may 4, 2007 figure 13. slew rate vs temperature figure 14. supply current per channel vs temperature figure 15. supply current per channel vs supply voltage figure 16. large sign al transient response figure 17. small signal transient response figure 18. package powe r dissipation vs ambient temperature typical performance curves 2.255 2.245 2.235 2.225 2.215 80 temperature (c) slew rate (v/s) -40 40 0 -20 60 20 v s =5v 0.185 0.18 0.175 0.17 0.16 85 temperature (c) supply current (ma) -35 -15 5 25 45 65 0.165 v s =5v 0.195 0.19 0.185 0.175 0.165 18 supply voltage (v) supply current (ma) 4 6 8 12 14 16 0.17 0.18 10 t a =25c 4s/div 1v/div 1s/div 20mv/div 3 2.5 2 1.5 1 0.5 0 0 25 50 75 100 125 150 85 ambient temperature (c) power dissipation (w) 2.703w 2.857w qfn32 ? ja =35c/w qfn24 ? ja =37c/w jedec jesd51-7 high effective thermal conductivity test board 870mw msop10 ? ja =115c/w
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 11 of 17 may 4, 2007 applications information product description the el5127, el5227, el5327, and el5427 unity gain buffers are fabricated using a high voltage cmos process. it exhibits rail-to-rail input and output capability and has low power consumption (120a per buffer). these features make the el5127, el5227, e l5327, and el5427 ideal for a wide range of general-purpose ap plications. when driving a load of 10k ? and 12pf, the el5127, el5227, el5327, and el5427 have a -3db bandwidth of 2.5mhz and exhibits 2.2v/s slew rate. operating voltage, input, and output the el5127, el5227, el5327, and el5427 are specified with a single nominal supply voltage from 5v to 15v or a split supply with its total range fr om 5v to 15v. correct operation is guaranteed for a supply r ange of 4.5v to 16.5v. most el5127, el5227, el5327, and e l5427 specifications are stable over both the full supply range and operating temperatures of -40c to +85c. parameter variations with operating voltage and/or tem perature are shown in the typical performance curves. the output swings of the e l5127, el5227, el5327, and el5427 typically extend to wi thin 80mv of p ositive and negative supply rails with load currents of 5ma. decreasing load currents will extend the output voltage range even closer to the supply rails. figure 22 shows the input and output waveforms for the devi ce. operation is from 5v supply with a 10k ? load connected to gnd. the input is a 10v p-p sinusoid. the output voltage is approximately 9.985v p-p . figure 19. package power dissipation vs ambient temperature figure 20. package power dissipation vs ambient temperature figure 21. package power dissipation vs ambient temperature typical performance curves jedec jesd51-7 high effective thermal conductivity test board 1.4 0 ambient temperature (c) power dissipation (w) 1.2 1 0.8 0.6 0.4 0.2 0 25 50 75 100 125 85 1.111w 1.333w 1.176w tssop28 ? ja =75c/w tssop24 ? ja =85c/w tssop20 ? ja =90c/w 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 255075 125150 ambient temperature (c) power dissipation (w) 100 85 714mw 758mw jedec jesd51-3 low effective thermal conductivity test board qfn32 ? ja =132c/w 486mw msop10 ? ja =206c/w qfn24 ? ja =140c/w jedec jesd51-3 low effective thermal conductivity test board 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 255075100125 ambient temperature (c) power dissipation (w) 85 714mw 833mw 781mw tssop28 ? ja =120c/w tssop24 ? ja =128c/w tssop20 ? ja =140c/w
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 12 of 17 may 4, 2007 figure 22. operation with rail-to-rail input and output short circuit current limit the el5127, el5227, el5327, and el5427 will limit the short circuit current to 120ma if the output is directly shorted to the positive or the negative supply. if an output is shorted indefinitely, the pow er dissipation could easily increase such that the devic e may be damaged. maximum reliability is maintained if the output continuous current neve r exceeds 30ma. this limit is set by the design of the internal metal interconnects. output phase reversal the el5127, el5227, el5327, and el5427 ar e immune to phase reversal as long as the input voltage is limited from v s - -0.5v to v s + +0.5v. figure 23 s hows a photo of the output of the device with the i nput voltage driven beyond the supply rails. although the de vice's output will not change phase, the input's overvoltage should be avoided. if an input voltage exceeds supply voltage by more than 0.6v, electrostatic protection diodes placed in the input stage of the device begin to conduct an d overvoltage damage could occur. figure 23. operation with beyond-the-rails input power dissipation with the high-output drive cap ability of the el5127, el5227, el5327, and el5427 buffer, it is possible to exceed the +125c absolute-maximum j unction temperature under certain load current conditions. therefore, it is important to calculate the maximum junc tion temperature for the application to determine if load conditions need to be modified for the buffer to remai n in the safe operating area. the maximum power dissipation allowed in a package is determined according to: where: t jmax = maximum junction temperature t amax = maximum ambien t temperature ? ja = thermal resistance of the package p dmax = maximum power dissipation in the package the maximum power dissipation actually produced by an ic is the total quiescent supply current times the total power supply voltage, plus the power i n the ic due to the loads, or: when sourcing, and : when sinking. where: i = 1 to total number of buffers v s = total supply voltage i smax = maximum quiescent current per channel v out i = maximum output volt age of the application i load i = load current if we set the two p dmax equations equal to each other, we can solve for r load i to avoid device overheat. the package power dissipation curves provide a convenient way to see if the device will overheat. the maximum safe power dissipation can be found graphi cally, based on the package type and the ambient temperature. by using the previous equation, it is a simple matter to see if p dmax exceeds the device's power derating curves. unused buffers it is recommended that any unused buffer have the input tied to the ground plane. output input 5v v s =5v t a =25c v in =10v p-p 5v 10s 1v v s =2.5v t a =25c v in =6v p-p 1v 10s p dmax t jmax - t amax ? ja -------------------------------------------- - = ? iv ? s i smax v s + ? - v out i ? i load i ? ? + ? = ? iv ? s i smax v ? out i - v s - ? i load i ? + ?? =
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 13 of 17 may 4, 2007 driving capacitive loads the el5127, el5227, el5327, and el5427 can drive a wide range of capacitive loads. as load capacitance increases, however, the -3db bandwidth of the device will decrease and the peaking increase. the bu ffers drive 10pf loads in parallel with 10k ? with just 1.5db of peaking, and 100pf with 6.4db of peaking. if less peaking is desired in these applications, a small series resistor (usually between 5 ? and 50 ? ) can be placed in series wit h the output. however, this will obviously reduce the gain slightly. another method of reducing peaking is to add a snubber circ uit at the output. a snubber is a shunt load consisti ng of a resistor in series with a capacitor. values of 150 ? and 10nf are t ypical. the advantage of a snubber is that it does not draw any dc load current or reduce the gain. power supply bypassing and printed circuit board layout as with any high frequency device, good printed circuit board layout is necessary for optimum performance. ground plane construction is highl y recommended, lead lengths should be as short as possibl e, and the power supply pins must be well bypassed to reduce the risk of oscillation. for normal single supply operation, where the v s - pin is connected to ground, a 0.1f c eramic capacitor should be placed from v s + pin to v s - pin. a 4.7f tantalum capacitor should then be connected from v s + pin to ground. one 4.7f capacitor may be used for multiple devices. this same capacitor combinatio n should be placed at each supply pin to ground if split supp lies are to be used.
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 14 of 17 may 4, 2007 mini so package family (msop) 1 (n/2) (n/2)+1 n plane seating n leads 0.10 c pin #1 i.d. e1 e b detail x 3 3 gauge plane see detail "x" c a 0.25 a2 a1 l 0.25 c a b d a m b e c 0.08 c a b m h l1 mdp0043 mini so package family symbol millimeters tolerance notes msop8 msop10 a1.101.10 max. - a1 0.10 0.10 0.05 - a2 0.86 0.86 0.09 - b 0.33 0.23 +0.07/-0.08 - c0.180.18 0.05 - d 3.00 3.00 0.10 1, 3 e4.904.90 0.15 - e1 3.00 3.00 0.10 2, 3 e0.650.50 basic - l0.550.55 0.15 - l1 0.95 0.95 basic - n 8 10 reference - rev. d 2/07 notes: 1. plastic or metal protrusions o f 0.15mm maximum per side are n ot included. 2. plastic interlead protrusions of 0.25mm maximum per side are not included. 3. dimensions d and e1 are measured at datum plane h. 4. dimensioning and tolerancing per asme y14.5m-1994.
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 15 of 17 may 4, 2007 qfn (quad flat no-lead) package family pin #1 i.d. mark 2 1 3 (n-2) (n-1) n (n/2) 2x 0.075 top view (n/2) ne 2 3 1 pin #1 i.d. (n-2) (n-1) n b l n leads bottom view detail x plane seating n leads c see detail "x" a1 (l) n leads & exposed pad 0.10 side view 0.10 b a m c c b a e 2x 0.075 c d 3 5 7 (e2) (d2) e 0.08 c c (c) a 2 c mdp0046 qfn (quad flat no-lead) package family (compliant to jedec mo-220) symbol millimeters tolerance notes qfn44 qfn3 qfn32 a 0.90 0.90 0.90 0.90 0.10 - a1 0.02 0.02 0.02 0.02 +0.03/-0.02 - b 0.25 0.25 0.23 0.22 0.02 - c 0.20 0.20 0.20 0.20 reference - d 7.00 5.00 8.00 5.00 basic - d2 5.10 3.80 5.80 3.60/2.48 reference 8 e 7.00 7.00 8.00 6.00 basic - e2 5.10 5.80 5.80 4.60/3.40 reference 8 e 0.50 0.50 0.80 0.50 basic - l 0.55 0.40 0.53 0.50 0.05 - n 44 38 32 32 reference 4 nd 11 7 8 7 reference 6 ne 11 12 8 9 reference 5 symbol millimeters toler- ance notes qfn28 qfn2 qfn20 qfn16 a 0.90 0.90 0.90 0.90 0.90 0.10 - a1 0.02 0.02 0.02 0.02 0.02 +0.03/ -0.02 - b 0.25 0.25 0.30 0.25 0.33 0.02 - c 0.20 0.20 0.20 0.20 0.20 reference - d 4.00 4.00 5.00 4.00 4.00 basic - d2 2.65 2.80 3.70 2.70 2.40 reference - e 5.00 5.00 5.00 4.00 4.00 basic - e2 3.65 3.80 3.70 2.70 2.40 reference - e 0.50 0.50 0.65 0.50 0.65 basic - l 0.40 0.40 0.40 0.40 0.60 0.05 - n 28 24 20 20 16 reference 4 nd 6 5 5 5 4 reference 6 ne 8 7 5 5 4 reference 5 rev 11 2/07 notes: 1. dimensioning and tolerancing per asme y14.5m-1994. 2. tiebar view shown is a non-functional feature. 3. bottom-side pin #1 i.d. is a diepad chamfer as shown. 4. n is the total number of terminals on the device. 5. ne is the number of terminals on the e side of the package (or y-direction). 6. nd is the number of terminals on the d side of the package (or x-direction). nd = (n/2)-ne. 7. inward end of terminal may be square or circular in shape wit h radius (b/2) as shown. 8. if two values are listed, mul tiple exposed pad options are av ailable. refer to device-s pecific datasheet.
el5127, el5227, el5327, el5427 fn7111 rev 4.00 page 16 of 17 may 4, 2007 thin shrink small outline package family (tssop) n (n/2)+1 (n/2) top view a d 0.20 c 2x b a n/2 lead tips b e1 e 0.25 cab m 1 h pin #1 i.d. 0.05 e c 0.10 c n leads side view 0.10 cab m b c see detail x end view detail x a2 0 - 8 gauge plane 0.25 l a1 a l1 seating plane mdp0044 thin shrink small outline package family symbol millimeters tolerance 14 ld 16 ld 20 ld 24 ld 28 ld a 1.20 1.20 1.20 1.20 1.20 max a1 0.10 0.10 0.10 0.10 0.10 0.05 a2 0.90 0.90 0.90 0.90 0.90 0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 d 5.00 5.00 6.50 7.80 9.70 0.10 e 6.40 6.40 6.40 6.40 6.40 basic e1 4.40 4.40 4.40 4.40 4.40 0.10 e 0.65 0.65 0.65 0.65 0.65 basic l 0.60 0.60 0.60 0.60 0.60 0.15 l1 1.00 1.00 1.00 1.00 1.00 reference rev. f 2/07 notes: 1. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. dimension ?e1? does not include interlead flash or protrusions. interlead flash and protrusi ons shall not exceed 0.25mm per side. 3. dimensions ?d? and ?e1? are measured at datum plane h. 4. dimensioning and tolerancing per asme y14.5m - 1994.
fn7111 rev 4.00 page 17 of 17 may 4, 2007 el5127, el5227, el5327, el5427 intersil products are manufactured, assembled and tested utilizing iso9001 quality systems as noted in the quality certifications found at www.intersil.com/en/suppor t/qualandreliability.html intersil products are sold by description on ly. intersil may modify the circuit design an d/or specifications of products at any time without notice, provided that such modification does not, in intersil's sole judgment, affect the form, fit or function of the product. accordingly, the reader is cautioned to verify that datasheets are current before placing orders. information fu rnished by intersil is believed to be accu rate and reliable. however, no responsib ility is assumed by intersil or its subsidiaries for its use; nor for any infrin gements of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com for additional products, see www.intersil.com/en/products.html ? copyright intersil americas ll c 2004-2007. all rights reserved. all trademarks and registered trademarks are the property of their respective owners. thin shrink small outlin e plastic packages (tssop) ? index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-153-ac, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material conditi on. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m20.173 20 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.252 0.260 6.40 6.60 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n20 207 ? 0 o 8 o 0 o 8 o - rev. 1 6/98

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