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Molex Electronics Ltd.
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| Part No. |
70247-1051 0702471051
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
TLV702475DBVR
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| Description |
300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1052 0702471052
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| Description |
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 10 Circuits, 0.76um
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 10 Circuits, 0.76um
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0702472054 70247-2054
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| Description |
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.127um (5u)
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.127um (5u")
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| File Size |
161.85K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-421HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702472052 70247-2052
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
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| File Size |
161.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
71276-410HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1251 0702471251
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-435HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1652 0702471652
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-117HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1252 0702471252
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| Description |
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-426HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1451 0702471451
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-414HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1054 0702471054
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-129HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1452 0702471452
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91276-431HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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| Tech specs |
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Official Product Page
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