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  70247-1276 Datasheet PDF File

For 70247-1276 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    70247-1266 70247-1276

Molex Electronics Ltd.
Part No. 70247-1266 70247-1276
Description 2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits, 0.38m
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits, 0.38m

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Texas Instruments

Part No. TLV702475DBVR
Description 300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. 2SD1276/2SD1276A
Description Low-Power, SC70/SOT µP Reset Circuits with Capacitor-Adjustable Reset Timeout Delay

File Size 62.88K  /  3 Page

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Texas Instruments

Part No. TLV702475DBVT
Description 300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
Tech specs    

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Official Product Page

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Part No. 70247-4851
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-421HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-2651

Molex Electronics Ltd.
Part No. 70247-2651
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 71276-410HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70247-2652

Molex Electronics Ltd.
Part No. 70247-2652
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-435HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-2654

Molex Electronics Ltd.
Part No. 70247-2654
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-117HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-0869

Molex Electronics Ltd.
Part No. 70247-0869
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, without

File Size 119.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 91276-426HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-6452

Molex Electronics Ltd.
Part No. 70247-6452
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-414HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-6451

Molex Electronics Ltd.
Part No. 70247-6451
Description 2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 64 Circuits

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-129HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 70247-4600
Description 46 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 44.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 91276-431HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

For 70247-1276 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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