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bonding Datasheet PDF File

For bonding Found Datasheets File :: 7132 Search Time::1.078ms
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				Raytheon
Part No.	RMWL05001
OCR Text	...ent to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grou...
Description	5 GHz low noise amplifier MMIC
File Size	407.26K / 6 Page	View it Online	Download Datasheet

				NEC Corp. NEC[NEC]
Part No.	UPD16650 UPD16650N MPD16650N-TCP MPD16650N-TAB UPD16650N-XXX
OCR Text	...re 100 g (per solder) Temporary bonding 70 to 100 C; pressure 3 to 8 kg/cm 2; time 3 to 5 secs. Real bonding 165 to 180 C; pressure 25 to 45 kg/cm 2; time 30 to 40 secs. (when using the anisotropic conductive film SUMIZAC1003 of Sumitomo Ba...
Description	120-/128-OUTPUT TFT-LCD GATE DRIVER 120-/128-OUTPUT的TFT - LCD栅极驱动 Interface IC
File Size	60.27K / 12 Page	View it Online	Download Datasheet

				Renesas
Part No.	RJP1CS07DWT RJP1CS07DWA
OCR Text	...tice. definition al pattern bonding area final passivation 10.5 8.85 1.31 7.48 1.88 0.81 1.45 10.5 1.88 1.88 1.88 1.45 emitter bonding pad (1) emitter bonding pad (4) emitter bonding pad (3) emitter bonding pad (2) gate bonding pad un...
Description	IGBT
File Size	126.01K / 4 Page	View it Online	Download Datasheet

				MSI
Part No.	EMSBC
OCR Text	...tachment to the substrate. wire bonding is made to the notched pad on top of the chip. emsbc's epoxy attachment to the substrate. wire bonding is made to the notched pad on top of the chip. emsbc's epoxy attachment to the substrate. wire bo...
Description	THIN FILM EMSBC SERIES
File Size	42.02K / 1 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1504N
OCR Text	...pression or thermo - sonic wire bonding. backside gold plating is compatible with standard ausn die - attach. t ypical application include commercial and military high performance power amplifiers . electrical specifications (t a =25 ...
Description	1W High Linearity and High Efficiency GaAs Power FETs
File Size	181.35K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	PCF1171C PCF1171CT PCF1171CU
OCR Text	...h all time setting functions. A bonding option allows the selection of 12-hour or 24-hour display mode. The circuit is battery-operated via an internal 5 V voltage regulator or by an external stabilized voltage supply. PACKAGE NAME VSO40...
Description	4-digit LCD car clock LCD CLOCK, PDSO40
File Size	112.24K / 16 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	PCF1172C PCF1172CT PCF1172CU
OCR Text	...ee Chapter "Chip dimensions and bonding pad locations" for pad layout and package details. 1997 Apr 16 2 Philips Semiconductors Product specification 31/2-digit LCD car clock PINNING SYMBOL OSC OUT OSC IN S1 S3 BP PM AM E2 D...
Description	3 1 /2 -digit LCD car clock(3 1 /2 数字 LCD汽车时钟) 3 1 / 2位LCD汽车时钟 1 / 2数字液晶汽车时钟 31/2-digit LCD car clock
File Size	110.83K / 16 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7132 Search Time::1.078ms
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