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bonding Datasheet PDF File

For bonding Found Datasheets File :: 7119 Search Time::1.375ms
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				http:// HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	INA-02100
OCR Text	...t 400C and either wedge or ball bonding using 0.7 mil gold wire.[1] Chip Outline[1] RF OUT GND 2 Description The INA-02100 is a low-noise silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) feedback amplifier chip. It is ...
Description	Low Noise/ Cascadable Silicon Bipolar MMIC Amplifier Low Noise, Cascadable Silicon Bipolar MMIC Amplifier Low Noise Cascadable Silicon Bipolar MMIC Amplifier
File Size	49.46K / 3 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA110B LMA110
OCR Text	...ique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.)...
Description	.5-8GHz MESFET Amplifier
File Size	105.87K / 4 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA110 LMA110A
OCR Text	...ique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.)...
Description	.5-6 GHz MESFET Amplifier
File Size	80.46K / 3 Page	View it Online	Download Datasheet

				Vishay Sfernice
Part No.	N76K54B
OCR Text	...ride substrate material silicon bonding pads aluminum or gold technical specifications test specifications conditions material ultrafilm absolute tcr 5 ppm/c 10 ppm/c/25 ppm/c 0 to + 70 c - 55 c to + 155 c stability: ? r / r 0.03 % 2000...
Description	RMK 55N, RMK 515N Wirebondable High Precision Single Value Thin Film Chip Resistors
File Size	91.22K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH37609
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz
File Size	176.40K / 6 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers List of Unclassifed Manufac... List of Unclassifed Man...
Part No.	173-7-220P 173-7-1212P 173-7-240A 173-7-240P 173-9-1212P 173-9-210P 173-9-240P 174-9-1212P 174-9-310P 175-6-230P 175-6-410P 175-6-310P 175-6-320P 175-6-330P 175-6-280P 175-6-240P 175-6-250P 175-6-610P 175-6-210P
OCR Text	...or general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which req...
Description	THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
File Size	254.21K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC34709
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 20 GHz
File Size	213.57K / 6 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7119 Search Time::1.375ms
Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |