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bonding Datasheet PDF File

For bonding Found Datasheets File :: 7111 Search Time::1.422ms
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				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMWB11001
OCR Text	...003" by 0.0005" Gold Ribbon for bonding.RF input and output bonds should be less than 0.015" long with stress relief. Detector delivers approx. 0.5V DC into 3 k load resistor for >+18 dBm output power. If output power level detection is not...
Description	11 GHz Buffer Amplifier MMIC
File Size	349.24K / 6 Page	View it Online	Download Datasheet

				Raytheon
Part No.	RMWL05001
OCR Text	...ent to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grou...
Description	5 GHz low noise amplifier MMIC
File Size	407.26K / 6 Page	View it Online	Download Datasheet

				Renesas
Part No.	RJP1CS07DWT RJP1CS07DWA
OCR Text	...tice. definition al pattern bonding area final passivation 10.5 8.85 1.31 7.48 1.88 0.81 1.45 10.5 1.88 1.88 1.88 1.45 emitter bonding pad (1) emitter bonding pad (4) emitter bonding pad (3) emitter bonding pad (2) gate bonding pad un...
Description	IGBT
File Size	126.01K / 4 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMWB12001
OCR Text	...ent to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grou...
Description	12 GHz Buffer Amplifier MMIC
File Size	195.44K / 6 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4BN1840-2
OCR Text	...cedures should be used. Wire bonding Thermosonic wedge wire bonding using 0.003" x 0.00025" ribbon or ball bonding with 0.001" diameter gold wire is recommended. A stage temperature of 150 oC and a force of 18 to 22 grams should be used...
Description	Monolithic HMIC Integrated Dual Bias Network 18 - 40 GHz
File Size	174.51K / 8 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U
OCR Text	...y. Chapter "Chip dimensions and bonding pad locations" shows exact pad locations for other delivery formats. PINNING SYMBOL VSS TEST OSC IN OSC OUT VDD M1 M2 RESET PIN 1 2 3 4 5 6 7 8 DESCRIPTION ground (0 V) test output oscillator input os...
Description	32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
File Size	69.26K / 12 Page	View it Online	Download Datasheet

				MSI
Part No.	EMSBC
OCR Text	...tachment to the substrate. wire bonding is made to the notched pad on top of the chip. emsbc's epoxy attachment to the substrate. wire bonding is made to the notched pad on top of the chip. emsbc's epoxy attachment to the substrate. wire bo...
Description	THIN FILM EMSBC SERIES
File Size	42.02K / 1 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1504N
OCR Text	...pression or thermo - sonic wire bonding. backside gold plating is compatible with standard ausn die - attach. t ypical application include commercial and military high performance power amplifiers . electrical specifications (t a =25 ...
Description	1W High Linearity and High Efficiency GaAs Power FETs
File Size	181.35K / 6 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1501
OCR Text	...ompression or thermo-sonic wire bonding. backside gold plating is compatible with standard ausn die-attach. typical application include commercial and military high performance power amplifiers. electrical specifications (t a =25 c) ...
Description	1W High Linearity and High Efficiency GaAs Power FETs
File Size	175.47K / 5 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4BN1840-1
OCR Text	...cedures should be used. Wire bonding Thermosonic wedge wire bonding using 0.003" x 0.00025" ribbon or ball bonding with 0.001" diameter gold wire is recommended. A stage temperature of 150 oC and a force of 18 to 22 grams should be used...
Description	Monolithic HMIC Integrated Bias Network 18 - 40 GHz
File Size	178.30K / 9 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7111 Search Time::1.422ms
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