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  70247-1276 Datasheet PDF File

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    70247-3451 0702473451

Molex Electronics Ltd.
Part No. 70247-3451 0702473451
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded34 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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Texas Instruments

Part No. TLV702475DBVR
Description 300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70247-3452 0702473452

Molex Electronics Ltd.
Part No. 70247-3452 0702473452
Description 2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded,34 Circuits, 0.76um
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded,34 Circuits, 0.76um

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Texas Instruments

Part No. TLV702475DBVT
Description 300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
Tech specs    

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Official Product Page

    70247-1654 0702471654

Molex Electronics Ltd.
Part No. 70247-1654 0702471654
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-421HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    0702474052 70247-4052

Molex Electronics Ltd.
Part No. 0702474052 70247-4052
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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Amphenol Communications Solutions

Part No. 71276-410HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0702474051 70247-4051

Molex Electronics Ltd.
Part No. 0702474051 70247-4051
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-435HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    0702474054 70247-4054

Molex Electronics Ltd.
Part No. 0702474054 70247-4054
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,40 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-117HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-6051 0702476051

Molex Electronics Ltd.
Part No. 70247-6051 0702476051
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-426HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-6052 0702476052

Molex Electronics Ltd.
Part No. 70247-6052 0702476052
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-414HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    0702473454 70247-3454

Molex Electronics Ltd.
Part No. 0702473454 70247-3454
Description 2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 34 Circuits, 0.127um

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-129HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    70247-4451 0702474451

Molex Electronics Ltd.
Part No. 70247-4451 0702474451
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 91276-431HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

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