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Amphenol Communications Solutions |
Part No. |
95687-150HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68602-150HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68690-150HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
79425-150HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
69192-150HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Microsemi, Corp. White Electronic Designs, Corp.
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Part No. |
WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE128K32NP-120H1Q WE128K32NP-150H1Q WE128K32NP-140H1Q WE128K32NP-140H1QA WE128K32NP-200H1QA WE128K32NP-250H1Q WE128K32NP-150H1QA WE128K32NP-120H1QA
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Description |
EEPROM MCP 128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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File Size |
403.23K /
14 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
68021-150HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
93939-150HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Right Angle, 4.06 mm (0.16in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 15001U |
Maker: EUPEC |
Pack: 高频管 |
Stock: 12 |
Unit price
for : |
50: $41.54 |
100: $39.46 |
1000:
$37.38 |
Email: oulindz@gmail.com |
Contact us |
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