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Molex Electronics Ltd.
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Part No. |
0015477636 15-47-7636
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
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File Size |
377.46K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-105-26LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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http:// Molex Electronics Ltd.
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Part No. |
15-47-7530 0015477530
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating
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File Size |
377.42K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54775-602-36LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0015477630 15-47-7630
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
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File Size |
377.46K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-102-36LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0015477632 15-47-7632
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
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File Size |
377.46K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-604-20LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0015477634 15-47-7634
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
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File Size |
377.52K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-706-50LF
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Description |
BERGSTIK DB DR
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54775-102-30LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54776-117-20LF
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Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-47-7524 0015477524 A-70568-0010
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating
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File Size |
377.43K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-106-40LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-47-7528 0015477528 A-70568-0012
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating
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File Size |
377.50K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-108-16LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-47-7510 0015477510 A-70568-0003
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating
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File Size |
377.42K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54776-113-06LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 547EI-A1 |
Maker: N/A |
Pack: N/A |
Stock: 381 |
Unit price
for : |
50: $31.02 |
100: $29.46 |
1000:
$27.91 |
Email: oulindz@gmail.com |
Contact us |
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