55755-0819 pdf Datasheet P1 Part Num --- IC-ON-LINE


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55755-0819 Datasheet PDF File

For 55755-0819 Found Datasheets File :: 74+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 |

					Molex Electronics Ltd.
Part No.	55755-0819 0557550819
Description	2.00mm (.079) Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, with Inner Positive Lock, 8 Circuits, Lead-free
File Size	165.66K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-201
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs				Official Product Page

HUA FENG CIRCUIT

					CW Industries
Part No.	GR5-626-0819
Description	SWITCH ASSEMBLY D.P.-D.T. W/SOLDER SHIELD & P.C. TERMINALS
File Size	65.43K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-201LF
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					Qualtek Electronics Corporation
Part No.	08190
Description	WIRE FORM FAN GUARD (176mm)
File Size	146.73K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-191LF
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					OPTREX
Part No.	UE-30819
Description	LCD_Module
File Size	138.83K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-001
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	55482-0819
Description	1.25mm (.049) Pitch Mini Mi II Wire-to-Wire Adapter, 8 Circuits, Lead-free
File Size	146.35K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-101
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87833-0819
Description	2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Fully Shrouded, Lead-free, 8 Circuits, Gold (Au) Flash Plating, without PCB Locator, without Locking Window
File Size	138.00K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-191
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs				Official Product Page

					Alpha Wire
Part No.	460819
Description	Customer Specification
File Size	101.84K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-001LF
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					MOLEX INC
Part No.	52746-2870 52746-0819
Description	28 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SURFACE MOUNT
File Size	596.26K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55755-101LF
Description	240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					Infineon
Part No.	CGY0819
Description	MESFET PA
File Size	339.69K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-112081950RLF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page


Part No.	2SB0819
Description	From old datasheet system
File Size	82.94K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-811081900LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 55755-0819 Found Datasheets File :: 74+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 |

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