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Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
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| Part No. |
MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
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| OCR Text |
...x18)*16pcs RIMM Module based on 576mb A-die, 32s banks,32K/32ms Ref, 2.5V
Overview
The RIMM module is a general purpose high- performance memory module suitable for use in a broad range of applications including computer memory, persona... |
| Description |
(32Mx18) 16pcs RIMM Module based on 576mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片，32秒银行，32K/32ms参考，.5V
(32Mx18) 16pcs RIMM Module based on 576mb A-die 32s banks32K/32ms Ref 2.5V
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| File Size |
256.70K /
14 Page |
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Download Datasheet
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Central Technologies / CT Magnetics
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| Part No. |
MT49H32M18FM-18IT
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| OCR Text |
...n data sheet specifications. 576mb: x36, x18, x9 2.5v v ext , 1.8v v dd , hstl, rldram ii features advance ? pdf: 09005aef81fe35b2/source: 09005aef81f83d49 micron technology, inc., reserves the right to change products or specifications ... |
| Description |
32M X 18 DDR DRAM, PBGA144 11 X 18.50 MM, MICRO, BGA-144
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| File Size |
1,302.39K /
49 Page |
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GSI Technology, Inc.
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| Part No. |
GS4576C18GL-24T GS4576C18GL-24I GS4576C18L-18T
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| OCR Text |
576mb cio low latency dram (lldram tm ) ii 533 mhz ? 300 mhz 2.5 v v ext 1.8 v v dd 1.5 v or 1.8 v v ddq 144-ball bga commercial temp industrial temp rev: 1.01 4/2011 1/63 ? 2011, gsi technology specifications cited are subject to ch... |
| Description |
DDR DRAM, PBGA144 ROHS COMPLIANT, UBGA-144
DDR DRAM, PBGA144 UBGA-144
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| File Size |
2,612.59K /
63 Page |
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Download Datasheet |
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