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  70543-0014 Datasheet PDF File

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    70543-0014

Molex Electronics Ltd.
Part No. 70543-0014
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Texas Instruments
Part No. SN0014HBL
Description Radiation-hardened, QMLV and QMLP, 1.5A ultra-low-noise high-PSRR low-dropout (LDO) regulator 14-CFP 25 to 25
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    70543-0018

Molex Electronics Ltd.
Part No. 70543-0018
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 19Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.19K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0038

Molex Electronics Ltd.
Part No. 70543-0038
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, Tin (Sn) Plating
File Size 418.20K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0020

Molex Electronics Ltd.
Part No. 70543-0020
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0024

Molex Electronics Ltd.
Part No. 70543-0024
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0022

Molex Electronics Ltd.
Part No. 70543-0022
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0021

Molex Electronics Ltd.
Part No. 70543-0021
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 22Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    70543-0010

Molex Electronics Ltd.
Part No. 70543-0010
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    70543-0017

Molex Electronics Ltd.
Part No. 70543-0017
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 18Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0016

Molex Electronics Ltd.
Part No. 70543-0016
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.18K  /  4 Page

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Renesas Electronics Corporation
Part No. RAA2900014H12HPD
Description Intelligent Power Device, TO-252-3, /
Tech specs 　 　

Official Product Page

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