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  70543-0020 Datasheet PDF File

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    70543-0020

Molex Electronics Ltd.
Part No. 70543-0020
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Cables on Demand
Part No. SF-NDYYYH0002-002M
Description Amphenol SF-NDYYYH0002-002M 2m (6.6') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 27 AWG) - QSFP-DD to QSFP-DD
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HUA FENG CIRCUIT





    70543-0016

Molex Electronics Ltd.
Part No. 70543-0016
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.18K  /  4 Page

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Amphenol Cables on Demand
Part No. CO-058BNCX200-200
Description Amphenol CO-058BNCX200-200 BNC Male to BNC Male (RG58) 50 Ohm Coaxial Cable Assembly 200ft
Tech specs 　 　

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    70543-0038

Molex Electronics Ltd.
Part No. 70543-0038
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, Tin (Sn) Plating
File Size 418.20K  /  4 Page

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Amphenol Cables on Demand
Part No. SF-NDVVYG0002-002M
Description Amphenol SF-NDVVYG0002-002M 2m (6.6') 400GbE OSFP Cable - Amphenol 400-Gigabit Ethernet Passive Copper OSFP Cable (28 AWG) – OSFP to OSFP 2m (6.6')
Tech specs 　 　

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    70543-0036

Molex Electronics Ltd.
Part No. 70543-0036
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2Circuits, Tin (Sn) Plating
File Size 418.20K  /  4 Page

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Rochester Electronics LLC
Part No. 100201SCX
Description 100201 - OR/NOR Gate, 100K Series, 1-Func, 2-Input, ECL, PDSO8
Tech specs 　 　

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    70543-0024

Molex Electronics Ltd.
Part No. 70543-0024
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    70543-0023

Molex Electronics Ltd.
Part No. 70543-0023
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 24Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    70543-0022

Molex Electronics Ltd.
Part No. 70543-0022
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs 　 　

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    70543-0014

Molex Electronics Ltd.
Part No. 70543-0014
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs 　 　

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    70543-0013

Molex Electronics Ltd.
Part No. 70543-0013
Description 2.54mm (.100) Pitch SLHeader, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.38um (15u)
File Size 418.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

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    70543-0010

Molex Electronics Ltd.
Part No. 70543-0010
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

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