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  71764-0208 Datasheet PDF File

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    0717640208 71764-0208

Molex Electronics Ltd.
Part No. 0717640208 71764-0208
Description 2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 8 Circuits
2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 8 Circuits

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Amphenol Communications Solutions

Part No. 51740-10208002AALF
Description PwrBlade®, Power Supply Connectors, 2P 80S 2P Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ZADC-ED10208/1

Mini-Circuits
Part No. ZADC-ED10208/1
Description 400 MHz - 2700 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.8 dB INSERTION LOSS-MAX CASE X0

File Size 104.58K  /  3 Page

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Amphenol Communications Solutions

Part No. 75160-302-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs    

Official Product Page

    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 10131930-208ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 8 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    71764-0018

Molex Electronics Ltd.
Part No. 71764-0018
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 75160-102-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs    

Official Product Page

    71764-0020

Molex Electronics Ltd.
Part No. 71764-0020
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 95293-102-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0022

Molex Electronics Ltd.
Part No. 71764-0022
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10121750-0802081LF
Description PwrBlade+® Connector, Power Connectors, 8HP+2S+8HP Right Angle, Header.
Tech specs    

Official Product Page

    71764-0024

Molex Electronics Ltd.
Part No. 71764-0024
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-102-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    71764-0026

Molex Electronics Ltd.
Part No. 71764-0026
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 75844-802-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 75844-102-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-208
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 08 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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