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Texas Instruments |
Part No. |
5962R2021401VXC
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Description |
Radiation-hardness-assured (RHA) 9-channel (8 remote and 1 local) high-accuracy temperature sensor 16-CFP -55 to 125
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71764-0018
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
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File Size |
120.83K /
5 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
HSP50214BVI
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Description |
Programmable Downconverter, MQFP-HS, /Tray
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
RJK0214DPA-00#J53
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Description |
P Channel Power MOSFET
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71764-0120
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
121.16K /
5 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
R4F20214RDFD#V0
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Description |
Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71764-0118
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
120.86K /
5 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
R4F20214RNFD#V0
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Description |
Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
HSP50214BVC
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Description |
Programmable Downconverter, MQFP-HS, /Tray
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71764-0116
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
121.10K /
5 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
5962-8700214ZA
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Description |
2K x 8 Dual-Port RAM
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R4F20214NFD#U0
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Description |
Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R4F20214DFD#U0
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Description |
Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
RAA230214GSB
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Description |
ICs for Microcontroller Power Supply System, HTSSOP-20, /Embossed Tape
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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