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  71764-0214 Datasheet PDF File

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    0717640214 71764-0214

Molex Electronics Ltd.
Part No. 0717640214 71764-0214
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

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Texas Instruments

Part No. 5962R2021401VXC
Description Radiation-hardness-assured (RHA) 9-channel (8 remote and 1 local) high-accuracy temperature sensor 16-CFP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0018

Molex Electronics Ltd.
Part No. 71764-0018
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating

File Size 120.83K  /  5 Page

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Renesas Electronics Corporation

Part No. HSP50214BVI
Description Programmable Downconverter, MQFP-HS, /Tray
Tech specs    

Official Product Page

    71764-0126

Molex Electronics Ltd.
Part No. 71764-0126
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Renesas Electronics Corporation

Part No. RJK0214DPA-00#J53
Description P Channel Power MOSFET
Tech specs    

Official Product Page

    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Renesas Electronics Corporation

Part No. R4F20214RDFD#V0
Description Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
Tech specs    

Official Product Page

    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 120.86K  /  5 Page

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Renesas Electronics Corporation

Part No. R4F20214RNFD#V0
Description Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
Tech specs    

Official Product Page

    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Renesas Electronics Corporation

Part No. HSP50214BVC
Description Programmable Downconverter, MQFP-HS, /Tray
Tech specs    

Official Product Page

    71764-0116

Molex Electronics Ltd.
Part No. 71764-0116
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.10K  /  5 Page

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Renesas Electronics Corporation

Part No. 5962-8700214ZA
Description 2K x 8 Dual-Port RAM
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Renesas Electronics Corporation

Part No. R4F20214NFD#U0
Description Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
Tech specs    

Official Product Page

    71764-0228

Molex Electronics Ltd.
Part No. 71764-0228
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.07K  /  5 Page

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Renesas Electronics Corporation

Part No. R4F20214DFD#U0
Description Microcontrollers with Ease-of-Use and Reduced CPU Processing Load Features (Non Promotion)
Tech specs    

Official Product Page

    71764-0224

Molex Electronics Ltd.
Part No. 71764-0224
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Renesas Electronics Corporation

Part No. RAA230214GSB
Description ICs for Microcontroller Power Supply System, HTSSOP-20, /Embossed Tape
Tech specs    

Official Product Page

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