73644-2109 pdf Datasheet P1 Part Num --- IC-ON-LINE

Amphenol Communications Solutions

Part No.

54112-109160800LF

Description

BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.

Tech specs

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73644-2109 Datasheet PDF File

For 73644-2109 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Molex Electronics Ltd.
Part No.	73644-2109
Description	2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size	163.64K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-1204
Description	2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits
File Size	167.28K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-3210
Description	2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 144 Circuits
File Size	164.13K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-0005
Description	2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size	166.78K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-2017
Description	2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
File Size	164.18K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-2018
Description	2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits
File Size	174.00K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-2016
Description	2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size	164.19K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-1207
Description	2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size	167.28K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-1202
Description	2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size	167.27K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	73644-1206
Description	2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits
File Size	159.58K / 4 Page	View it Online	Download Datasheet

For 73644-2109 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |