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  87759-0850 Datasheet PDF File

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    87759-0850 87759-0851

Molex Electronics Ltd.
Part No. 87759-0850 87759-0851
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-805220850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-0850 87759-0851

Molex Electronics Ltd.
Part No. 87759-0850 87759-0851
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-806100850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4815

Molex Electronics Ltd.
Part No. 87759-4815
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.40K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-105360850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-0464

Molex Electronics Ltd.
Part No. 87759-0464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 4 Circuits

File Size 421.14K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-806360850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1415

Molex Electronics Ltd.
Part No. 87759-1415
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.56K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-107060850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-0675

Molex Electronics Ltd.
Part No. 87759-0675
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits

File Size 280.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-801600850LF
Description BERGSTIK
Tech specs    

Official Product Page

    87759-0664

Molex Electronics Ltd.
Part No. 87759-0664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits

File Size 421.14K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-105460850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 46 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-4264

Molex Electronics Ltd.
Part No. 87759-4264
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-105100850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-3465

Molex Electronics Ltd.
Part No. 87759-3465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-106260850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-3274

Molex Electronics Ltd.
Part No. 87759-3274
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-107180850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 87759-0850 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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