|
|
 |
Amphenol Communications Solutions |
Part No. |
10131318-2421100LF
|
Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 24 Positions, Non GW Compatible Nylon66, Tray Packing.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
10131318-24211G0LF
|
Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 24 Positions, GW Compatible Nylon66, Tray Packing.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87834-5095
|
Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05渭m (2渭) Gold (Au) Plating 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating
|
File Size |
115.25K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-105300950LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68024-218HLF
|
Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87834-4419
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator 2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13楼矛m (5楼矛) Gold (Au) Plating, Black, without PCB Locator
|
File Size |
115.14K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-109282200LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87834-4411
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window 2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
|
File Size |
127.58K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-105101000LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-110042050LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87834-5021
|
Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13渭m (5渭) Gold (Au) Flash Plating, Nylon Housin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing
|
File Size |
124.27K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-106261100LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87834-5019
|
Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, 50 Circuits, 0.13渭m (5渭) Gold (Au) Plating, Black, without PCB Locator 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 50 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
|
File Size |
114.98K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-107081400LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
54242-110101450LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|