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T0820 80C97 D2018UK AD7834BR LQ11S43 2N5550 MB95F 50242
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  87834-4011 Datasheet PDF File

For 87834-4011 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-4011 0878344011

Molex Electronics Ltd.
Part No. 87834-4011 0878344011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4011BP
Description CMOS Logic IC, 2-Input/NAND, DIP14
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-4021

Molex Electronics Ltd.
Part No. 87834-4021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 77315-401-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87834-2611

Molex Electronics Ltd.
Part No. 87834-2611
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 26 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-107401100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-2641

Molex Electronics Ltd.
Part No. 87834-2641
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-115401100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-2645

Molex Electronics Ltd.
Part No. 87834-2645
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 77315-401-17LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87834-2695

Molex Electronics Ltd.
Part No. 87834-2695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 98401-101-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-2619

Molex Electronics Ltd.
Part No. 87834-2619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 98401-101-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-4143

Molex Electronics Ltd.
Part No. 87834-4143
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 98401-102-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-4095

Molex Electronics Ltd.
Part No. 87834-4095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Download Datasheet

   

Amphenol Communications Solutions

Part No. 77315-401-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87834-4092

Molex Electronics Ltd.
Part No. 87834-4092
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows

File Size 100.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 98401-101-48LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87834-4011 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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