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  A-70280-0114 Datasheet PDF File

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    0010897680 A-70280-0114 010-89-7680

Molex Electronics Ltd.
Part No. 0010897680 A-70280-0114 010-89-7680
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 421.73K  /  4 Page

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Amphenol Communications Solutions
Part No. 51740-10702807AALF
Description PwrBlade®, Power Supply Connectors, 7P 28S 7P STB Vertical Receptacle.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    A-70280-0028

Molex Electronics Ltd.
Part No. A-70280-0028
Description 2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
File Size 421.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 51720-10702807ABLF
Description PwrBlade®, Power Supply Connectors, 7P 28S 7P STB Right Angle Header.
Tech specs 　 　

Official Product Page

    A-70280-0115

Molex Electronics Ltd.
Part No. A-70280-0115
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 421.68K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    70280-0009

Molex Electronics Ltd.
Part No. 70280-0009
Description 2.54mm Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 18
File Size 27.41K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    70280-0493

Molex Electronics Ltd.
Part No. 70280-0493
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
File Size 283.66K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    70280-0012

Molex Electronics Ltd.
Part No. 70280-0012
Description 2.54mm Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24
File Size 27.42K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    Molex, Inc.
Part No. 70280-0724
Description CGrid VT Bkwy Hdr Tin 32Ckt (320/185) 32 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size 416.35K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114868-T0J-20DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs 　 　

Official Product Page

    70280-0006

Molex Electronics Ltd.
Part No. 70280-0006
Description 2.54mm Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 12
File Size 27.47K  /  2 Page

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Amphenol Communications Solutions
Part No. 77315-401-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    70280-0005

Molex Electronics Ltd.
Part No. 70280-0005
Description 2.54mm Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 10
File Size 27.47K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114868-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs 　 　

Official Product Page

    70280-0015

Molex Electronics Ltd.
Part No. 70280-0015
Description 2.54mm Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 30
File Size 27.47K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114868-10J-20DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs 　 　

Official Product Page

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