backside pdf Datasheet P1 Description --- IC-ON-LINE


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backside Datasheet PDF File

For backside Found Datasheets File :: 9+ Page :: | <1> |

					KODENSHI KOREA CORP.
Part No.	HL615
Description	Available to be mounted on the PCB backside
File Size	187.94K / 3 Page	View it Online	Download Datasheet

					IXYS Corporation
Part No.	IXGR40N60B
Description	HiPerFASTTM IGBT (Electrically Isolated backside)
File Size	54.16K / 2 Page	View it Online	Download Datasheet

					IXYS Corporation
Part No.	IXSR35N120BD1
Description	IGBT with Diode ISOPLUS 247 (Electrically Isolated backside)
File Size	70.92K / 2 Page	View it Online	Download Datasheet

					IXYS[IXYS Corporation]
Part No.	IXSR40N60BD1
Description	IGBT with Diode ISOPLUS 247 (Electrically Isolated backside)
File Size	38.18K / 2 Page	View it Online	Download Datasheet

					IXYS Corporation
Part No.	IXFL34N100
Description	HiPerFETTM Power MOSFETs ISOPLUS264(Electrically Isolated backside)
File Size	113.85K / 2 Page	View it Online	Download Datasheet

					Atmel
Part No.	PC755BM8
Description	PC755B 1MByte backside L2-cache Multi-Chip Package
File Size	45.64K / 2 Page	View it Online	Download Datasheet

					Atmel
Part No.	PC7410M16 PC7410M16VG400L
Description	PC7410 2MByte backside L2-cache Multi-Chip Package RISC microprocessor. 16 Mbits: 256K x 72 SSRAM. Max internal processor speed 400 MHz. 1.8V -100mV.
File Size	351.43K / 35 Page	View it Online	Download Datasheet

					IXYS
Part No.	IXFR4N100Q
Description	Discrete MOSFETs: HiPerFET Power MOSFETS HiPerFET Power MOSFETs ISOPLUS247 (Electrically Isolated backside)
File Size	77.29K / 2 Page	View it Online	Download Datasheet

					Motorola
Part No.	MPX2301DT1 MPX2300DT1
Description	MPX2300DT1 Chip Pak High Volume Pressure Sensor for Disposable, backside Pressure Applications High Volume Pressure Sensor For Disposable Applications
File Size	58.24K / 4 Page	View it Online	Download Datasheet

For backside Found Datasheets File :: 9+ Page :: | <1> |

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