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  C67076-A2013-A70 Datasheet PDF File

For C67076-A2013-A70 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. BSM150GAL120DN2 150L12N2 C67076-A2013-A70 BSM100GAL120DN2 C67076-A2012-A70
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:18; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT功率模块(单用菜刀包括快速续流二极管二极管开关)
From old datasheet system
IGBT Power Module (Single switch with chopper diode Including fast free-wheeling diodes)

File Size 80.48K  /  5 Page

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Texas Instruments

Part No. TPA2013D1RGPR
Description 2.7-W Constant Output Power Mono Class-D Audio Amplifier with Integrated Boost Converter (TPA2013) 20-QFN -40 to 85
Tech specs    

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Official Product Page

HUA FENG CIRCUIT





    SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. C67076-A2106-A70 BSM75GB120DN2
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT功率模块(半桥包括快速续流二极管的绝缘金属基片包
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

File Size 112.10K  /  9 Page

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Texas Instruments

Part No. TPA2013D1YZHR
Description 2.7-W Constant Output Power Mono Class-D Audio Amplifier with Integrated Boost Converter (TPA2013) 16-DSBGA -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. BSM50GB120DN2 C67076-A2105-A70
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; No. of Contacts:18; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

File Size 111.59K  /  9 Page

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Renesas Electronics Corporation

Part No. R2A20132SP
Description Critical Conduction Mode Interleave PFC Control IC, SOP, /Tape &amp; Reel
Tech specs    

Official Product Page

    BSM25GB120DN2 C67076-A2109-A70

Siemens Semiconductor G...
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
SIEMENS A G
Part No. BSM25GB120DN2 C67076-A2109-A70
Description IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
Circular Connector; No. of Contacts:19; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Right Angle Plug; Insert Arrangement:14-19 IGBT功率模块(半桥包括快速续流二极管的绝缘金属基片包

File Size 111.41K  /  9 Page

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Renesas Electronics Corporation

Part No. R2A20133ASP#W5
Description ICs for PFC Power Supply, SOP, /Embossed Tape
Tech specs    

Official Product Page

    CXA2013

Sony Corporation
Part No. CXA2013
Description CAP, SMT(V), FILM, 1UF, 100V, 10%

File Size 199.84K  /  23 Page

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Renesas Electronics Corporation

Part No. R2A20131SP#W0
Description Continuous Conduction Mode PFC Control IC, SOP, /
Tech specs    

Official Product Page

   
Part No. A20055 A20135
Description MASSEKONTAKT SCHLUESSELSCHALTER
TUELLE P5 SCHLUESSELSCHALTER

File Size 83.96K  /  1 Page

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Renesas Electronics Corporation

Part No. R2A20132SP#U0
Description Critical Conduction Mode Interleave PFC Control IC, SOP, /Tape &amp; Reel
Tech specs    

Official Product Page

    SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. BSM150GB120DN2 C67076-A2108-A70
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

File Size 130.46K  /  9 Page

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Renesas Electronics Corporation

Part No. R2A20131SP#W5
Description Continuous Conduction Mode PFC Control IC
Tech specs    

Official Product Page

    CXA2013 CXA2013M

SONY[Sony Corporation]
Part No. CXA2013 CXA2013M
Description EIAJ Sound Multiplexing Decoder
EIAJ Sound Multiplexing Decoder

File Size 195.28K  /  23 Page

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Renesas Electronics Corporation

Part No. R2A20134ASP#W5
Description ICs for LED Lighting
Tech specs    

Official Product Page

    Philips
Part No. UBA2013L
Description HB driver IC

File Size 323.16K  /  22 Page

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Renesas Electronics Corporation

Part No. R2A20133DSP#W5
Description Critical Conduction Mode PFC Control IC
Tech specs    

Official Product Page

    SAA2013H

NXP Semiconductors
Part No. SAA2013H
Description Adaptive allocation and scaling for PASC coding in DCC systems

File Size 135.56K  /  32 Page

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Renesas Electronics Corporation

Part No. R2A20131SP
Description Continuous Conduction Mode PFC Control IC
Tech specs    

Official Product Page

For C67076-A2013-A70 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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