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14500 1013B AN168 W9NK90 MICON 307C1296 4ACT24 OP04CZ
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  cooling Datasheet PDF File

For cooling Found Datasheets File :: 24280    Search Time::1.625ms    
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    TLE6220 TLE6220GP Q67006-A9315

INFINEON[Infineon Technologies AG]
Part No. TLE6220 TLE6220GP Q67006-A9315
OCR Text ...rint junction - ambient @ 6 cm2 cooling area RthJC RthJA Symbol VS VDS VIN VLoad Dump 2) Values -0.3 ... +7 45 - 0.3 ... + 7 62 52 Unit V V V V Tj Tstg ID(lim) ID EAS Ptot VESD - 40 ... + 150 - 55 ... + 150 ID(lim) min 1 50 3 2...
Description Smart Quad Low-Side Switch
Smart Low Side Switches - Smart Quad Channel Lowside Switch

File Size 736.12K  /  17 Page

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    ADL855PC-600C-G5 ADL855PC ADL855PC-140-G5 ADL855PC-373C-G5 ADL855PC-738-G5 ADL855PC-745-G5

Advanced Digital Logic, Inc.
Part No. ADL855PC-600C-G5 ADL855PC ADL855PC-140-G5 ADL855PC-373C-G5 ADL855PC-738-G5 ADL855PC-745-G5
OCR Text ...ly effective active and passive cooling solutions based on proven thermal data and mounting techniques; resulting in the least possible mechanical board stress. Please contact your Sales Engineer for detailed information on cooling solution...
Description CPU 0.6GHz - 1.8GHz

File Size 411.07K  /  2 Page

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    C1-2N4S-10

Superworld Electronics
Part No. C1-2N4S-10
OCR Text ... Preheating Dipping Natural cooling 60 seconds 61 seconds Solderability More than 90% of the terminal electrode should be covered with new solder. Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2405C ...
Description CERAMIC CHIP INDUCTORS

File Size 389.35K  /  7 Page

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    MBRS1100 MBRS1100T3

MOTOROLA INC
MOTOROLA[Motorola, Inc]
Part No. MBRS1100 MBRS1100T3
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description Schottky Power Rectifier(Surface Mount Power Package)

File Size 74.10K  /  4 Page

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    MMBD6050LT1 ON2082

MOTOROLA[Motorola, Inc]
Part No. MMBD6050LT1 ON2082
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description From old datasheet system
Switching Diode

File Size 76.02K  /  4 Page

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    MMBD770T1 MMBD110T1 MMBD330T1 MMDD110T1 ON2076 MMBD110T1-D

MOTOROLA[Motorola, Inc]
ONSEMI[ON Semiconductor]
Part No. MMBD770T1 MMBD110T1 MMBD330T1 MMDD110T1 ON2076 MMBD110T1-D
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description From old datasheet system
SCHOTTKY BARRLER DLODES
Schottky Barrier Diodes

File Size 153.70K  /  8 Page

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    MMBF0201 MMBF0201N

MOTOROLA[Motorola, Inc]
Part No. MMBF0201 MMBF0201N
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

File Size 178.83K  /  6 Page

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    MMBF0202PLT1 MMBF0202PL ON2091

MOTOROLA[Motorola, Inc]
Part No. MMBF0202PLT1 MMBF0202PL ON2091
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description From old datasheet system
P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

File Size 190.27K  /  6 Page

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    MMBF4391LT1 MMBF4392L MMBF4392LT1 MMBF4393LT1 ON2098

MOTOROLA[Motorola, Inc]
ONSEMI[ON Semiconductor]
Part No. MMBF4391LT1 MMBF4392L MMBF4392LT1 MMBF4393LT1 ON2098
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description From old datasheet system
CASE 3188, STYLE 10 SOT3 (TO?36AB
JFET Switching Transistors

File Size 137.40K  /  6 Page

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    MMBTH10LT1

MOTOROLA[Motorola, Inc]
Part No. MMBTH10LT1
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description VHF/UHF Transistor

File Size 86.76K  /  6 Page

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For cooling Found Datasheets File :: 24280    Search Time::1.625ms    
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