| |
|
 |
Intersil, Corp.
|
| Part No. |
DP3D64MX8RY5-60C
|
| OCR Text |
...ently released to production at dense-pac microsystems, inc. dense-pac reserves the right to change products or specifications herein without prior notice. pin names a0 - a11 row address: a0 - a11 column address: a0 - a11 refresh address: a... |
| Description |
64K X 8 FAST PAGE DRAM MODULE, 60 ns, QMA48 LEADLESS, TSOP-48
|
| File Size |
247.90K /
2 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Omron Electronics LLC Industrial Automation
|
| Part No. |
DP3Z2MX16PMBY5-90CI
|
| OCR Text |
...onsideration for development at dense-pac microsystems, inc. dense-pac reserves the right to change or discontinue information on this product without prior notice. pin names a0 - a19 address dq0 - dq15 data input / output ce 0, ce 1 low ... |
| Description |
2M X 16 FLASH 3.3V PROM MODULE, 90 ns, QMA56 STACK, TSOP-56
|
| File Size |
376.58K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
|
| Part No. |
DP5Z1MM16PI3-12C DP5Z1MM16PJ3-12B DP5Z1MW16PA3-12B DP5Z1MM16PJ3-12C DP5Z1MM16PJ3-20M
|
| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc). available unleaded, straight leaded, ??j?? leaded, gullwing leaded packages, or mounted on a 50-pin pga co-fired ceramic substrate. the... |
| Description |
1M X 16 FLASH 5V PROM, 120 ns, CQIP48 HERMETIC SEALED, STRAIGHT, SLCC-48
1M X 16 FLASH 5V PROM, 120 ns, CQCC48
1M X 16 FLASH 5V PROM, 120 ns, CPGA50
1M X 16 FLASH 5V PROM, 150 ns, CQCC48
|
| File Size |
4,778.74K /
21 Page |
View
it Online |
Download Datasheet |
| |
|
|
Twilight Technology, Inc.
|
| Part No. |
DP5Z4MW16PI3-12C
|
| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc). available unleaded, straight leaded, ??j?? leaded, gullwing leaded packages, or mounted on a 50-pin pga co-fired ceramic substrate. th... |
| Description |
4M X 16 FLASH 5V PROM, 120 ns, QMA48 STRAIGHT LEAD PACKAGE-48
|
| File Size |
1,013.97K /
21 Page |
View
it Online |
Download Datasheet |
| |
|
|
Twilight Technology, Inc.
|
| Part No. |
DP5Z4MX16PI3-12C
|
| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc). available unleaded, straight leaded, ??j?? leaded, gullwing leaded packages, or mounted on a 50-pin pga co-fired ceramic substrate. th... |
| Description |
4M X 16 FLASH 5V PROM MODULE, 120 ns, CQIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
| File Size |
2,901.21K /
21 Page |
View
it Online |
Download Datasheet |
| |
|
|
|
| Part No. |
DPSD96MX8WKY5-DP-XXP12
|
| OCR Text |
... presently under development at dense-pac microsystems, inc. dense-pac reserves the right to change products or specifications herein without prior notice.
dpsd96mx8wky5 dense-pac microsystems, inc. notes: [1] available in industrial temp... |
| Description |
96M X 8 SYNCHRONOUS DRAM MODULE, PDSO54
|
| File Size |
341.63K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
TWILIGHT TECHNOLOGY INC
|
| Part No. |
DPS128C32BV3-30M
|
| OCR Text |
...gh speed memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc) mounted on a co-fired ceramic substrate. it offers 4 megabits of sram in a package envelope of 1.090 x 1.090 x 0.300 inches. the dps128c... |
| Description |
128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, CPGA66
|
| File Size |
761.71K /
7 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
