| |
|
 |
SGS Thomson Microelectronics
|
| Part No. |
AN1547
|
| OCR Text |
...ackage compatible with standard reflow processes. These components are delivered in tape&reel with the bumps turned down (placed on the bottom of the carrier tape cavity). The other face of the component is flat and allows picking as in the... |
| Description |
FLIP CHIP 170MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIERS
|
| File Size |
68.82K /
6 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Littelfuse, Inc.
|
| Part No. |
MLE
|
| OCR Text |
...eries is compatible with modern reflow and wave soldering procedures. Littelfuse Inc. manufactures other Multilayer Series products. See the ML Series data sheet for higher energy/peak current transient applications. See the AUML Series for... |
| Description |
Multilayer Transient Voltage Suppressor
|
| File Size |
129.67K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
SGS Thomson Microelectronics
|
| Part No. |
AN1553
|
| OCR Text |
...ackage compatible with standard reflow processes. These components are delivered in tape&reel with the bumps turned down (placed on the bottom of the carrier tape cavity). The other face of the component is flat and allows picking as in the... |
| Description |
FLIP CHIP 300MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIER
|
| File Size |
68.17K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
SGS Thomson Microelectronics
|
| Part No. |
AN577
|
| OCR Text |
...ce mounting techniques (wave or reflow)
The diodes are pre-orientated and the tape can be used directly on automatic pick and place equipment. Picking up is easy thanks to the rectangular parallelepiped shape. For this, the use of a vacu... |
| Description |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE
|
| File Size |
40.73K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
SGS Thomson Microelectronics
|
| Part No. |
AN899
|
| OCR Text |
...gh temperature (> 200 C) during reflow soldering process. Furthermore, molding compounds used for integrated circuit encapsulation absorb moisture from the ambient medium. During rapid heating in solder reflow process (see further for more ... |
| Description |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION
|
| File Size |
129.83K /
12 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
