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For solder Found Datasheets File :: 91737 Search Time::1.656ms
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				ONSEMI[ON Semiconductor] MOTOROLA[Motorola Inc] Motorola, Inc
Part No.	MMBT5551LT1 MMBT5550LT1_D MMBT5550LT1 ON2126
OCR Text	...e correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.0...
Description	High Voltage Transistors(NPN Silicon) *Motorola Preferred Device From old datasheet system
File Size	199.67K / 6 Page	View it Online	Download Datasheet

				Pasternack Enterprises, Inc.
Part No.	PE4421
OCR Text	solder attachment for rg178, rg196, .235 inch d hole sma female bulkhead connector clamp/solder attachment for rg178, rg196, .235 inch d hole confguration connector sma female connector interface type rg178,rg196 cable attachment meth...
Description	SMA Female Bulkhead Connector Clamp/solder Attachment For RG178, RG196, .235 inch D Hole
File Size	281.00K / 2 Page	View it Online	Download Datasheet

				Pasternack Enterprises, Inc.
Part No.	PE44211
OCR Text	solder attachment 0.042 inch end launch pcb, .250 inch diameter, .030 inch diameter sma female bulkhead connector solder attachment 0.042 inch end launch pcb, .250 inch diameter, .030 inch diameter confguration connector sma female con...
Description	SMA Female Bulkhead Connector solder Attachment 0.042 inch End Launch PCB, .250 inch Diameter, .030 inch Diameter
File Size	224.55K / 2 Page	View it Online	Download Datasheet

				FREESCALE SEMICONDUCTOR INC
Part No.	MPXV5010GC6U/T1
OCR Text	...e correct size to ensure proper solder connection inter- face between the board and the package. with the correct footprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards...
Description	GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 5%, 0.20-4.70V, SQUARE, SURFACE MOUNT
File Size	212.53K / 12 Page	View it Online	Download Datasheet

				LIGITEK electronics co., ltd.
Part No.	LA140B-1-VY-S1-PF
OCR Text	...ime only) Distance:2mm Min(From solder joint to case) 2.Wave soldering Profile Dip soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5 C/sec(max) solder Bath:260 C Max Dipping Time:3 seconds Max Dist...
Description	LED ARRAY
File Size	102.40K / 6 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets] OKI ELECTRIC INDUSTRY CO LTD
Part No.	MSM6595 MSM6595A MSM6595A-XXX MSM6595A-XXXRS MSM6595A-XXXJS
OCR Text	...ad frame material Pin treatment solder plate thickness Package weight (g) Epoxy resin 42 alloy solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SH...
Description	1-Mbit Serial Voice ROM From old datasheet system 1M X 1 MASK PROM, PDIP18
File Size	163.28K / 13 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets] OKI SEMICONDUCTOR CO., LTD.
Part No.	MSM6596A MSM6596A-XXX
OCR Text	...ad frame material Pin treatment solder plate thickness Package weight (g) Epoxy resin 42 alloy solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SH...
Description	2-Mbit Serial Voice ROM From old datasheet system
File Size	167.86K / 13 Page	View it Online	Download Datasheet

				OKI electronic componet... OKI SEMICONDUCTOR CO., LTD. OKI[OKI electronic componets] OKI electronic components
Part No.	MSM6597A MSM6597A-XXX
OCR Text	...ad frame material Pin treatment solder plate thickness Package weight (g) Epoxy resin 42 alloy solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SH...
Description	From old datasheet system 3-Mbit Serial Voice ROM
File Size	138.75K / 10 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets]
Part No.	MSM6599 MSM6599B MSM6599BGS-BK MSM6599BGS-K
OCR Text	...ad frame material Pin treatment solder plate thickness Package weight (g) Epoxy resin 42 alloy solder plating 5 mm or more 1.29 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA ar...
Description	80-DOT SEGMENT DRIVER From old datasheet system
File Size	128.29K / 11 Page	View it Online	Download Datasheet

				LIGITEK electronics co., ltd.
Part No.	LA140B-1-YG-5-PF
OCR Text	...One Time) Distance:2mm Min(From solder joint to case) 2.Wave soldering Profile Dip soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) solder Bath:260C Max Dipping Time:3 seconds Max Dista...
Description	LED ARRAY
File Size	116.86K / 7 Page	View it Online	Download Datasheet

For solder Found Datasheets File :: 91737 Search Time::1.656ms
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