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For soldering Found Datasheets File :: 142463    Search Time::2.328ms    
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    NSSW204CT

NICHIA CORPORATION
Part No. NSSW204CT
OCR Text ... 2599c <cat .n o . 130115> 5 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing cond it ion temperature 350c max soldering time 3sec max ...
Description WHITE LED

File Size 404.11K  /  17 Page

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    L-T69FRGBCT-SA

PARA LIGHT ELECTRONICS CO., LTD.
Part No. L-T69FRGBCT-SA
OCR Text ... ? compatible with ir reflow soldering and ttw soldering. ? pb free product and acceptable lead-free process! ? meet rohs green product. l application ? backlighting (switches, keys, displays, illuminated advertising) ? ...
Description SURFACE MOUNT DEVICE LED

File Size 201.22K  /  15 Page

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    ECLIPTEK CORP
Part No. E2SLA12-11.2896M
OCR Text ...d 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 con...
Description QUARTZ CRYSTAL RESONATOR, 11.2896 MHz

File Size 139.23K  /  4 Page

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    ECLIPTEK CORP
Part No. E1SLA12-9.8304MTR
OCR Text ...d 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 con...
Description QUARTZ CRYSTAL RESONATOR, 9.8304 MHz

File Size 191.52K  /  5 Page

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    ECLIPTEK CORP
Part No. E1SLA12-14.31818MTR
OCR Text ...d 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 con...
Description QUARTZ CRYSTAL RESONATOR, 14.31818 MHz

File Size 191.66K  /  5 Page

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    PMEG2015EPK PMEG2015EPK-15

NXP Semiconductors
Part No. PMEG2015EPK PMEG2015EPK-15
OCR Text ... standard footprint. [3] reflow soldering is the only recommended soldering method. [4] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] for schottky barrier d...
Description 20 V, 1.5 A low VF MEGA Schottky barrier rectifier

File Size 1,122.22K  /  14 Page

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    PHP109/T3

NXP SEMICONDUCTORS
Part No. PHP109/T3
OCR Text ... t s is the temperature at the soldering point of the drain lead. 2. pulse width and duty cycle limited by maximum junction temperature. 3. value based on a printed-circuit board with a r th a-tp (ambient to tie-point) of 27.5 k/w. 4. valu...
Description 5 A, 30 V, 0.09 ohm, P-CHANNEL, Si, POWER, MOSFET, MS-012AA

File Size 80.06K  /  12 Page

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    PESD5V0F1BSF PESD5V0F1BSF-15

NXP Semiconductors
Part No. PESD5V0F1BSF PESD5V0F1BSF-15
OCR Text ...tional esd protection diode 10. soldering fig 9. reflow soldering footprint dsn0603-2 (sod962) footprint information for reflow soldering of leadless ultra small package; 2 terminals sod962 sod962_fr solder land solder resist solder land ...
Description Extremely low capacitance bidirectional ESD protection diode

File Size 353.65K  /  12 Page

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