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NXP Semiconductors N.V.
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| Part No. |
LPC1774FBD144
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| OCR Text |
...s; body 15 ? 15 ? 0.7 mm sot950-1 lpc1788fet180 tfbga180 thin fine-pitch ball grid array package; 180 balls; body 12 ? 12 ?? 0.8 mm sot570-2 lpc1788fbd144 lqfp144 plastic low profile quad flat package; 144 leads; body 20 ? 20 ?... |
| Description |
Cortex-M3 with 128 kB flash, 40 kB SRAM, USB 2.0 Device, CAN, 12-bit ADC
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| File Size |
1,219.30K /
117 Page |
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it Online |
Download Datasheet
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NXP Semiconductors N.V.
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| Part No. |
LPC4078FET180 LPC4076FET180 LPC4072FET80 LPC4078FBD100
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| OCR Text |
...lls; body 15 ? 15 ? 0.7 mm sot950-1 lpc4088fet180 tfbga180 thin fine-pitch ball grid array package; 180 balls sot570-3 lpc4088fbd144 lqfp144 plastic low profile quad flat package; 144 leads; body 20 ? 20 ? 1.4 mm sot486-1 lpc4078 l... |
| Description |
32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI
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| File Size |
2,693.44K /
141 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors N.V.
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| Part No. |
LPC2460FBD208 LPC2460FET208
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| OCR Text |
...alls; body 15 ? 15 ? 0.7 mm sot950-1 lpc2460fbd208 lqfp208 plastic low profile q uad flat package; 208 leads; body 28 ? 28 ? 1.4 mm sot459-1 lpc2460fet208 tfbga208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 ... |
| Description |
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface
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| File Size |
582.56K /
87 Page |
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it Online |
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NXP
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| Part No. |
LPC1774 LPC1778FET180
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| OCR Text |
...s; body 15 ? 15 ? 0.7 mm sot950-1 lpc1788fet180 tfbga180 thin fine-pitch ball grid array package; 180 balls; body 12 ? 12 ?? 0.8 mm sot570-2 lpc1788fbd144 lqfp144 plastic low profile quad flat package; 144 leads; body 20 ? 20 ?... |
| Description |
(LPC177x / LPC178x) 32-bit ARM Cortex-M3 microcontroller
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| File Size |
1,949.74K /
120 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors N.V.
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| Part No. |
LPC2420FET208 LPC242009 LPC2460 LPC2460FBD208551
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| OCR Text |
...08 balls; body 15 x 15 x 0.7 mm sot950-1 LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm sot950-1
LPC2420_60_4
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
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| Description |
Flashless 16-bit/32-bit micro; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface; Package: SOT459-1 (LQFP208); Container: Tray Dry Pack, Bakeable, Single 32-BIT, MROM, 72 MHz, RISC MICROCONTROLLER, PQFP208
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface
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| File Size |
375.14K /
78 Page |
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it Online |
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