wafers pdf Datasheet P1 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : FA1L4L MC283 2PFT2 EM55300 SI4800 102M0 TS118STR JCS4N60B
	Product Description
	Full Text Search

wafers Datasheet PDF File

For wafers Found Datasheets File :: 871 Search Time::1.625ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Analog Devices, Inc. AD[Analog Devices]
Part No.	AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586KR AD586L AD586LQ AD586LR AD586M AD586MN AD586S AD586SQ AD586T AD586TQ AD586LN
OCR Text	...diamond saw is used to separate wafers into dice thus providing perpendicular edges half-way through the die. In contrast to scribed dice, this technique provides a more uniform die shape and size. The perpendicular edges facilitate handlin...
Description	High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDIP8 High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, CDIP8 High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDSO8 High Precision 5 V Reference 高精 V参
File Size	196.90K / 8 Page	View it Online	Download Datasheet

				ANALOG DEVICES INC Analog Devices, Inc.
Part No.	AD587 AD587JCHIPS AD587JN AD587JQ AD587JR AD587KN AD587KQ AD587KR AD587LN AD587LQ AD587SQ AD587TQ AD587UQ
OCR Text	...diamond saw is used to separate wafers into dice thus providing perpendicular edges halfway through the die. In contrast to scribed dice, this technique provides a more uniform die shape and size . The perpendicular edges facilitate handlin...
Description	High Precision 10 V Reference
File Size	115.88K / 8 Page	View it Online	Download Datasheet

				Wing Shing Computer Components
Part No.	TL431LT1
OCR Text	...1.5 Physical Characteristics wafers Size Scribe width Wafer's Backside 4 inch 1.35 x 0.99 mm 90 m Ti - Ni - Ag: Ti - 0.1 0.02 m Ni - 0.5 0.1 m Ag - 0.6 0.1 m Passivation PSG 460 40 m (thickness) 4-4
Description	Adjustable Precision Shunt Regulator
File Size	127.68K / 4 Page	View it Online	Download Datasheet

				ATMEL[ATMEL Corporation]
Part No.	AT88SC1608-09ET-00 AT88SC1608-09PT-00 AT88SC1608-10CI-00 AT88SC1608-10PI-00 AT88SC1608-10SI-00 AT88SC1608-10WI-00 AT88SC1608
OCR Text	...lown by Atmel prior to shipping wafers to the card manufacturer. The CMA fuse is blown by the card manufacturer prior to shipping cards to the issuer. The PER fuse is blown by the issuer prior to shipping cards to the end user. The fuses...
Description	8 x 256 x 8 Secure Memory with Authentication
File Size	194.09K / 25 Page	View it Online	Download Datasheet

				ETC HP[Agilent(Hewlett-Packard)]
Part No.	ATF-34143 ATF-34143-BLK ATF-34143-TR1 ATF-34143-TR2 DEMO-ATF3X14-33
OCR Text	...0 Cpk = 1.37245 Std = 0.66 9 wafers Sample Size = 450 IDS (mA) 150 0V -3 Std 60 +3 Std 100 40 50 -0.6 V 20 0 29 0 0 2 4 VDS (V) 6 8 30 31 32 33 34 35 OIP3 (dBm) Figure 1. Typical/Puls...
Description	评估板，亚欧信托基金X14300兆赫930-1990兆赫频率 Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package
File Size	111.58K / 15 Page	View it Online	Download Datasheet

				Micrel Semiconductor,Inc. MICREL[Micrel Semiconductor]
Part No.	MPD8020
OCR Text	...ages. Quick Turnaround Prepared wafers can be held prior to the final process (metallization) where the customer's unique interconnect pattern is applied. This speeds turnaround by allowing many of the fabrication steps to be completed befo...
Description	CMOS/DMOS Semicustom High-Voltage Array Summary Information*.Not Recommended for New Designs
File Size	30.04K / 2 Page	View it Online	Download Datasheet

				STMICROELECTRONICS[STMicroelectronics]
Part No.	STE2002 STE2002DIE1 STE2002DIE2 STE2002DIE2NBSP
OCR Text	... host mcontroller. Type Bumped wafers Bumped Dice on Waffle Pack Ordering Number STE2002DIE1 STE2002DIE2 s s s s Figure 1. Block Diagram CO to C127 R0 to R80 ICON OSC_IN OSC_OUT OSC TIMING GENERATOR CLOCK COLUMN DRIVE...
Description	81 X 128 SINGLE CHIP LCD CONTROLLER / DRIVER
File Size	491.67K / 51 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	STGP12NB60K
OCR Text	... samples taken from 5 different wafers. Future wafers allocated to this product may have nominal values anywhere between the upper and lower limits. 6. Measurements are made on production test board, which represents a trade-off between opt...
Description	SHORT CIRCUIT PROOF PowerMESH?? IGBT
File Size	867.25K / 24 Page	View it Online	Download Datasheet

For wafers Found Datasheets File :: 871 Search Time::1.625ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |