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Renesas Electronics Corporation |
Part No. |
DA7280-00V4C
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Description |
Low Power High-Definition Haptic Driver for Next Generation Human Machine Interfaces
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7S721000VCBG#AC0
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Description |
RTOS MPU with 10MB of On-chip RAM
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Tech specs |
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Official Product Page
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Mimix Broadband, Inc.
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Part No. |
XP1022-QF-0N00 XP1022-QF-EV1
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Description |
17.0-25.0 GHz GaAs MMIC Power Amplifier, QFN 17000 MHz - 25000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER 17.0-25.0 GHz GaAs MMIC Power Amplifier, QFN 17.0-25.0千兆赫的GaAs MMIC功率放大器,QFN封装
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File Size |
867.55K /
8 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
R7S721000VCFP#AA0
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Description |
RTOS MPU with 10MB of On-chip RAM
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7S721000VLFP#AA0
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Description |
RTOS MPU with 10MB of On-chip RAM
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7S721000VLFP#AA1
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Description |
RTOS MPU with 10MB of On-chip RAM
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7S721000VCFP#AA1
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Description |
RTOS MPU with 10MB of On-chip RAM
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
DA14581-00000VRA
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Description |
Smartbond™ Bluetooth® Low Energy Solution for A4WP and HCI Applications
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7S721000VCBG#AC1
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Description |
RTOS MPU with 10MB of On-chip RAM
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
DA7280-00V42
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Description |
Low Power High-Definition Haptic Driver for Next Generation Human Machine Interfaces
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
DA14585-00000VV2
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Description |
SmartBond™ Bluetooth 5.0 SoC with Audio Interface
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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