| PART |
Description |
Maker |
| KBE00S009M-D411 KBE00S009M |
From old datasheet system
1Gb NAND x 2 256Mb Mobile SDRAM x 2
|
SAMSUNG[Samsung semiconductor]
|
| KBE00S009M-D411 KBE00S009M-D4110 |
1Gb NAND x 2 256Mb Mobile SDRAM x 2
SPECIALTY MEMORY CIRCUIT, PBGA137
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| HYS64T128020HM-3.7-A HYS64T128020HM-5-A |
256MB - 1GB, 214 pins
|
Infineon
|
| S30MS512P25BAW000 S30MS512P25BAW003 S30MS512P25BFW |
32M X 16 FLASH 1.8V PROM, 25 ns, PBGA137
1Gb/512Mb, x8/x16, 1.8 Volt NAND Interface Memory Based on MirrorBit??Technology
1Gb/512Mb, x8/x16, 1.8 Volt NAND Interface Memory Based on MirrorBitTechnology 128M X 8 FLASH 1.8V PROM, 25 ns, PBGA137
1Gb/512Mb, x8/x16, 1.8 Volt NAND Interface Memory Based on MirrorBit?/a> Technology
1Gb/512Mb, x8/x16, 1.8 Volt NAND Interface Memory Based on MirrorBit Technology
|
SPANSION LLC
Spansion, Inc.
|
| STN8810BDS12HPBE STN8810S12 |
STn8810 mobile multimedia application processor with 1-Gbit NAND-Flash and 512-Mbit DDR mobile RAM
|
STMicroelectronics
|
| H26M11001BAR |
1GB e-NAND
|
Hynix
|
| HY27UA081G1M HY27SA161G1M HY27SA081G1M |
NAND Flash - 1Gb
|
Hynix Semiconductor
|
| W948D2FBJX5E W948D2FBJX5I W948D2FBJX6E W948D2FBJX6 |
256Mb Mobile LPDDR
|
Winbond
|
| H5MS2562JFR-E3M H5MS2562JFR-J3M H5MS2562JFR-K3M H5 |
256Mb (16Mx16bit) Mobile DDR SDRAM
|
Hynix Semiconductor
|
| HY27SS08561M HY27US08561M |
NAND Flash - 256Mb
|
Hynix Semiconductor
|
| WV3EG265M72EFSU262D4S WV3EG265M72EFSU265D4SG |
1GB - 2x64Mx72 DDR SDRAM, UNBUFFERED, PLL, FBGA 1GB 2x64Mx72 DDR内存，无缓冲，锁相环，FBGA封装
|
Square D by Schneider Electric
Diodes, Inc.
|
