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  00158 Datasheet PDF File

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    0015800189

Molex Electronics Ltd.
Part No. 0015800189
Description MOLEX Connector

File Size 1,218.56K  /  7 Page

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HUA FENG CIRCUIT





    15-80-0103 0015800103

Molex Electronics Ltd.
Part No. 15-80-0103 0015800103
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
Molex Electronics Ltd.

File Size 1,218.38K  /  7 Page

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    0014600158

Molex Electronics Ltd.
Part No. 0014600158
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb)

File Size 159.55K  /  3 Page

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    15-80-0143 0015800143

Molex Electronics Ltd.
Part No. 15-80-0143 0015800143
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.47K  /  7 Page

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    0015800163 15-80-0163

Molex Electronics Ltd.
Part No. 0015800163 15-80-0163
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    0015800183

Molex Electronics Ltd.
Part No. 0015800183
Description MOLEX Connector

File Size 1,218.47K  /  7 Page

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    15-80-0123 0015800123

Molex Electronics Ltd.
Part No. 15-80-0123 0015800123
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.43K  /  7 Page

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    0015800663

Molex Electronics Ltd.
Part No. 0015800663
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    15-80-0323 0015800323

Molex Electronics Ltd.
Part No. 15-80-0323 0015800323
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    15-80-0401 0015800401

Molex Electronics Ltd.
Part No. 15-80-0401 0015800401
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.27K  /  7 Page

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