00158 pdf Datasheet P4 Part Num --- IC-ON-LINE


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00158 Datasheet PDF File

For 00158 Found Datasheets File :: 140+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |

					Molex Electronics Ltd.
Part No.	0015800645
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
File Size	1,218.18K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87900-158HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0015800369 15-80-0369
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
File Size	1,218.35K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800425
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.29K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800721
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating
File Size	1,218.25K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800265
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.30K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0383 0015800383
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	1,218.08K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0385 0015800385
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.29K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800681 15-80-0681
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating
File Size	1,218.24K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800483
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
File Size	1,218.25K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800565
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.29K / 7 Page	View it Online	Download Datasheet

For 00158 Found Datasheets File :: 140+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |

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