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Holtek Semiconductor In...
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| Part No. |
HT6207 HT680 HT600
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| OCR Text |
...ernally trinary programmable if bonded out. it is other- wise set floating internally. various packages of the 3 18 encoders offer flexible combinations of programmable address/data to meet various application needs. the programmable addres... |
| Description |
318 Series of Encoders
318 Series of Encoders
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| File Size |
165.45K /
15 Page |
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Holtek Semiconductor
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| Part No. |
HT46801B-1 HT46801N-1
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| OCR Text |
... is the adc power supply and is bonded together internally with vdd while avss is the adc ground pin and is bonded together internally with vss. ht46r01b-1/ht46r01n-1 ht48r01b-1/ht48r01n-1 rev.1.00 3 june 9, 2011 www.datasheet.co.kr datas... |
| Description |
(HT4xR01x-1) Small Package 8-Bit OTP MCU
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| File Size |
593.40K /
71 Page |
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SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K4R571669D
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| OCR Text |
... pinouts and definitions center-bonded devices these tables shows the pin a ssignments of the center-bonded rdram package. the mechanical dimensions of this package are shown in a later section. refer to section ? center-bonded wbga pac... |
| Description |
256/288Mbit RDRAM(D-die)
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| File Size |
313.24K /
20 Page |
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Holtek Semiconductor
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| Part No. |
HT48C50 HT48C10
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| OCR Text |
...e tmr0 and tmr1 pads have to be bonded to vdd or vss if the tmr0 and/or tmr1 pad are not used. the (tmr0) int indicates that the tmr0 pad should be bonded to the int pin. the pc5 (tmr1) indicates that the tmr1 pad should be bonded to the ... |
| Description |
(HT48Cxx) 8-Bit Microcontroller Series
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| File Size |
1,941.66K /
59 Page |
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