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RS0204 3PR5K D366KS 13F62 EM4444 MMBZ5227 6DAF1 02111
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    ARIES ELECTRONICS INC
Part No. 06-006-152FB 10-2.125-152FB
OCR Text bonded cable jumpers note: aries specializes in custom design and production. in addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. aries...
Description INTERCONNECTION DEVICE

File Size 139.48K  /  1 Page

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    8940 8943

3M Electronics
Part No. 8940 8943
OCR Text ...hermally conductive tape 8940) bonded to 3.0 mm minimum thickness aluminium on one side and 0.86 mm minimum thickness fr-4 laminate on other side. application guidelines 1.) substrate surfaces should be clean and dry...
Description 3M Thermally Conductive Adhesive Tape 8940 / 8943

File Size 39.54K  /  4 Page

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    051144-01762-1 051144-20052-8 051144-20053-5 051144-20054-2 051144-77595-8 051144-77596-5 051144-01738-6 051144-77598-9

3M Electronics
Part No. 051144-01762-1 051144-20052-8 051144-20053-5 051144-20054-2 051144-77595-8 051144-77596-5 051144-01738-6 051144-77598-9
OCR Text ... hand pads/rolls 67C68 bonded abrasives bonded type 27 wheels 69 bonded type 28 wheels 69 cut-off wheels 70 superabrasives wheels 78C85 dressing and t ruing tools 85...
Description Engineered Metalworking Solutions

File Size 9,501.83K  /  130 Page

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    CYPRESS SEMICONDUCTOR CORP
Part No. CYW15G0201DXB-BBXC
OCR Text ...an be operated independently or bonded to form wider buses. each channel can accept either 8-bit data characters or pre-encoded 10-bit transmission characters. data characters are passed from the transmit input register to an embedded 8b/10...
Description SPECIALTY TELECOM CIRCUIT, PBGA196

File Size 706.42K  /  46 Page

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    SIEMENS AG
Part No. SIEMENSAG-SLE4442M3
OCR Text ...sle 4432 m3 on request wire-bonded module m3 sle 4432 c on request chip sle 4442 m3 on request wire-bonded module m3 sle 4442 c on request chip 1) values are temper...
Description ICs for Chip Cards / Intelligent 256/64/128-Byte EEPROM

File Size 152.26K  /  14 Page

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    CYPRESS SEMICONDUCTOR CORP
Part No. CYP15G0401DXB-BGXI
OCR Text ...n be operated independently or bonded to form wider buses. each channel can accept either eight-bit data characte rs or pre-encoded 10-bit trans - mission characters. data characters are passed from the transmit input register to an embe...
Description Quad HOTLink II (TM) Transceiver; Features: Channel Bonding, 8B/10B, Redundancy, BIST, JTAG; Frequency Range: 0.2 to 1.5 Gbps; Standard: Ethernet, Fibre Channel, ESCON, DVB-ASI;

File Size 713.72K  /  54 Page

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    HT16C23

Holtek Semiconductor Inc
Part No. HT16C23
OCR Text ...1. the option ( pad 5) must be bonded to v dd or foating. 2. the ic substrate should be connected to v ss in the pcb layout artwork. 3. vlcd (pad 68) and vcca2 (pad 1) must be bonded together for the application at v dd v lcd or v...
Description RAM Mapping 56*4 / 52*8 LCD Driver Controller

File Size 665.09K  /  35 Page

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