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Samsung Electronic SAMSUNG[Samsung semiconductor]
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Part No. |
K4R881869D K4R571669D
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OCR Text |
...Pinouts and Definitions
Center-bonded Devices
These tables shows the pin assignments of the center-bonded RDRAM package. The mechanical dimensions of this
Direct RDRAMTM
package are shown in a later section. Refer to Section "Center... |
Description |
256/288Mbit RDRAM(D-die)
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File Size |
309.27K /
20 Page |
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Mindspeed Technologies
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Part No. |
M02140-XX
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OCR Text |
... Not connected. (Not internally bonded, can be connected to any DC potential including ground) Enables setting of output voltage swing from 400 mVpp differential to 800 mVpp differential using an external 1% resistor (RAMPSET) to ground Gro... |
Description |
Low Power 3.3V Limiting Amplifier For Applications to 12.5 Gbps Low Power 3.3 Volt Limiting Amplifier
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File Size |
400.00K /
20 Page |
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it Online |
Download Datasheet |
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List of Unclassifed Man...
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Part No. |
1872A007A1000
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OCR Text |
bonded-pair cable for more information please call 1-800-belden1 see put-ups and colors related documents : no. 8 for datatwist cables (modified western electric).pdf description: 23 awg bonded-pairs, solid bare copper conductor,... |
Description |
23 AWG bonded-pairs, solid bare copper conductor, non-plenum, polyolefin insulation, rip cord, see color code chart
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File Size |
33.07K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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