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    4-002.125-152FBP 5-002.125-152FBP 6-002.125-152FBP 7-002.125-152FBP 8-002.125-152FBP 18-002.25-152FBP 20-002.25-152FBP 2

Aries Electronics, Inc.
Part No. 4-002.125-152FBP 5-002.125-152FBP 6-002.125-152FBP 7-002.125-152FBP 8-002.125-152FBP 18-002.25-152FBP 20-002.25-152FBP 22-002.25-152FBP 21-002.25-152FBP 16-002.25-152FBP 15-002.25-152FBP 13-002.25-152FBP 14-002.25-152FBP 12-002.25-152FBP 11-002.25-152FBP 7-002.25-152FBP 10-002.25-152FBP 9-002.25-152FBP 11-002.5-152FBP 9-002.5-152FBP 10-002.5-152FBP 5-002.5-152FBP 8-002.5-152FBP 7-002.5-152FBP 6-002.5-152FBP 4-002.5-152FBP 12-002.5-152FBP 13-002.5-152FBP 14-002.5-152FBP 15-002.5-152FBP 16-002.5-152FBP 17-002.5-152FBP 18-002.5-152FBP 19-002.5-152FBP 20-002.5-152FBP 21-002.5-152FBP 22-002.5-152FBP 10-002.125-152FBP 11-002.125-152FBP 13-002.125-152FBP 15-002.125-152FBP 16-002.125-152FBP 17-002.125-152FBP 18-002.125-152FBP 9-002.125-152FBP 12-002.125-152FBP 14-002.125-152FBP 14-002-152FBP 5-002-152FBP 11-002-152FBP 15-002-152FBP 22-002.125-152FBP 16-002-152FBP 19-002-152FBP 19-002.125-152FBP 21-002.125-152FBP 21-002-152FBP 17-002-152FBP 8-002-152FBP 20-002.125-152FBP 20-002-152FBP
OCR Text bonded Cable Jumpers FEATURES * Series 152FB fusion-bonded Cable Jumpers are flexible - plug them directly into PC boards or sockets. * Stranded wire conductors are fusion bonded with an overcoat of Sn for easy soldering or socketing. * Ea...
Description Fusion bonded Cable Jumpers

File Size 465.70K  /  1 Page

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    HT82D40REW

Holtek Semiconductor Inc
Part No. HT82D40REW
OCR Text ...espectively. These pins are not bonded out to the external pins and internally connected to the relevant RF Transceiver lines. PB0~PB2 are also not bonded out to the external pins and internally connected to the corresponding RF Transceiver...
Description 2.4GHz Transceiver USB Interface 8-Bit OTP MCU

File Size 991.30K  /  104 Page

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    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4R881869D K4R571669D
OCR Text ...Pinouts and Definitions Center-bonded Devices These tables shows the pin assignments of the center-bonded RDRAM package. The mechanical dimensions of this Direct RDRAMTM package are shown in a later section. Refer to Section "Center...
Description 256/288Mbit RDRAM(D-die)

File Size 309.27K  /  20 Page

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    CYP15G0201DXB CYP15G0201DXB-BBI CYP15G0201DXB-BBC CYV15G0201DXB-BBI CYV15G0201DXB CYV15G0201DXB-BBC

CYPRESS[Cypress Semiconductor]
Part No. CYP15G0201DXB CYP15G0201DXB-BBI CYP15G0201DXB-BBC CYV15G0201DXB-BBI CYV15G0201DXB CYV15G0201DXB-BBC
OCR Text ...an be operated independently or bonded to form wider buses. Each channel can accept either 8-bit data characters or pre-encoded 10-bit transmission characters. Data characters are passed from the Transmit Input Register to an embedded 8B/10...
Description From old datasheet system
Dual-channel HOTLink II Transceiver
Physical Layer Devices : Multi-Protocol PHYs

File Size 572.26K  /  46 Page

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    STV0056A

ST Microelectronics
STMicroelectronics
Part No. STV0056A
OCR Text ...PTION (continued) A 12V Double bonded main power pin for the audio/FM section of the chip. The two bond connections are to the ESD and to power the circuit and on chip regulators/references. A GND L This ground pin is double bonded : 1) to...
Description SATELLITE SOUND AND VIDEO PROCESSORS

File Size 251.61K  /  26 Page

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    HS0-6254RH-Q HS1-6254RH HS-6254RH 5962F9764101VXC 5962F9764101VEC HS1-6254RH/SAMPLE HS1B-6254RH-Q 5962F9764101VEA HS1-62

Intersil Corporation
Intersil, Corp.
Part No. HS0-6254RH-Q HS1-6254RH HS-6254RH 5962F9764101VXC 5962F9764101VEC HS1-6254RH/SAMPLE HS1B-6254RH-Q 5962F9764101VEA HS1-6254RH-Q HS9-6254RH-Q
OCR Text ... a common substrate. One of our bonded wafer, dielectrically isolated fabrication processes provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. The high FT (8GHz) and...
Description Radiation Hardened Ultra High Frequency NPN Transistor Array(抗辐射甚高频NPN晶体管阵
1500PF 50V 0805
BJT
Radiation Hardened Ultra High Frequency NPN Transistor Array 辐射加固超高频NPN晶体管阵

File Size 30.64K  /  3 Page

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    Mindspeed Technologies
Part No. M02140-XX
OCR Text ... Not connected. (Not internally bonded, can be connected to any DC potential including ground) Enables setting of output voltage swing from 400 mVpp differential to 800 mVpp differential using an external 1% resistor (RAMPSET) to ground Gro...
Description Low Power 3.3V Limiting Amplifier For Applications to 12.5 Gbps Low Power 3.3 Volt Limiting Amplifier

File Size 400.00K  /  20 Page

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    List of Unclassifed Man...
Part No. 1872A007A1000
OCR Text bonded-pair cable for more information please call 1-800-belden1 see put-ups and colors related documents : no. 8 for datatwist cables (modified western electric).pdf description: 23 awg bonded-pairs, solid bare copper conductor,...
Description 23 AWG bonded-pairs, solid bare copper conductor, non-plenum, polyolefin insulation, rip cord, see color code chart

File Size 33.07K  /  5 Page

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    HS-1254RH HS9-1254RH HS9-1254RH-Q 5962R9858101VXC

Intersil Corporation
Part No. HS-1254RH HS9-1254RH HS9-1254RH-Q 5962R9858101VXC
OCR Text ...ments. Dielectric isolation and bonded wafer processing make this device immune to latch-up (SEL). Excellent dynamic characteristics, coupled with the disable function, make this amplifier well-suited for a variety of satellite system appli...
Description Radiation Hardened/ High Speed/ Low Power Dual Operational Amplifier with Disable
Radiation Hardened, High Speed, Low Power Dual Operational Amplifier with Disable

File Size 18.33K  /  3 Page

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    HS-1410RH 5962F9851801VXC HS9-1410RH-Q

Intersil Corporation
Intersil, Corp.
Part No. HS-1410RH 5962F9851801VXC HS9-1410RH-Q
OCR Text ...omplementary bipolar UHF-1 (DI, bonded wafer) process. This technology provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices are QML approved and are manu...
Description Radiation Hardened/ High Speed/ Low Power/ Current Feedback Op Amp with Output Disable
CAP 4-ARRAY 47000PF 16V X7R 1206
Radiation Hardened, High Speed, Low Power, Current Feedback Op Amp with Output Disable(抗辐射高速、低功耗电流反馈放大器(输出禁止))
Radiation Hardened, High Speed, Low Power, Current Feedback Op Amp with Output Disable OP-AMP, PDFP10

File Size 22.21K  /  2 Page

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