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SIEMENS AG
SIEMENS A G
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| Part No. |
SLE4432M2.2 SLE4442M2.2 SLE4442C
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| OCR Text |
...e sle 4432 m2.2 on request wire-bonded module m2.2 sle 4432 c on request chip sle 4442 m2.2 on request wire-bonded module m2.2 sle 4442 c on request chip 1) values are temperature dependent, for further information please refer to your siem... |
| Description |
ICs for Chip Cards Intelligent 256-Byte EEPROM
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| File Size |
1,006.35K /
35 Page |
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it Online |
Download Datasheet
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Honeywell
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| Part No. |
DC1000 DC1010 DC1020 DC1030
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| OCR Text |
...note: this connection shall be bonded to protective earth at the source of supply in accordance with national local electrical code requirements. earth ground. functional earth connection. note: this connection shall be bonded ... |
| Description |
Digital Controller Product Manual
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| File Size |
1,441.56K /
60 Page |
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it Online |
Download Datasheet |
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Intersil
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| Part No. |
IS-1825ASRH
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| OCR Text |
...ol circuit ground) pads must be bonded to ground. these pads are both bonded to the gnd pin on the packaged devices. 2. all double-sized bond pads must be double bonded for current sharing purposes.
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| Description |
Dual Output PWM, High Speed, Single Event Rad-Hard and Total Dose Hardened
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| File Size |
477.61K /
2 Page |
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it Online |
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Intersil
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| Part No. |
HS-6254RH
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| OCR Text |
... a common substrate. One of our bonded wafer, dielectrically isolated fabrication processes provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. The high FT (8GHz) and... |
| Description |
NPN Transistor Array, 5 NPN Array, 8GHz, 3.5dB Noise Figure, Rad-Hard
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| File Size |
30.64K /
3 Page |
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it Online |
Download Datasheet |
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Price and Availability
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